维普期刊资源整合服务平台（V6.5）

908篇 您的检索式：期刊名="Component Package Technology"

选中清除导出查看参考文献查看引证文献引用追踪共46页首页上一页第1页下一页末页 /46 跳转

	题名	作者	年代	出处	被引量
1	Electrical conduction models for isotropically conductive adhesive joints显示文摘	MORRIS J E	1997	IEEE Transactions on Components Package Manufacturing Technology1997，20，1：	1
2	Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder Interface显示文摘	XU L H PANG J H L PRAKASH K H	2005	IEEE Transactions on Components and Packaging Technology2005，28，3：	1
3	Multi-Objective placement of electronic components using evolutionary algorithms显示文摘	DEB K JAIN P GUPTA N	2004	IEEE Transactions on Components and Packaging Technologies2004，27，3：	1
4	Thermal simulation of switchgear显示文摘	Paulke J Weichert H Steinhaeuser P	2002	IEEE Transactions on Components and Packaging Technologies2002，25，3：	1
5	Simultaneous Measuremertl of PWB and Chip Package Warpage Using Automatielmage Segmentalion显示文摘	Reinhard E Powell Ume I Charles	2007	1EEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES2007，60，3：	1
6	Mechanical reliability of Sn-Ag BGA solder joints with various electrolyses Ni-P and Ni-B plating layers显示文摘	Yoon J W Noh B I Jung S B	2010	Components and Packaging Technologies2010，33，1：	1
7	Mechanism of electrical con- duction though anisotropically conductive adhesive films 显示文摘	Mizuno M Saka M Abe H	1996	IEEE Transactions on Components Packaging and Manufacturing Technology Part A1996，19，4：	1
8	Effects of Cu/Al intermetallic compound on copper wire and aluminum pad bondability显示文摘	Kim H J Lee J Y Paik K W	2003	IEEE Transactions on Components and Packaging Technology2003，26，2：	1
9	Influence of microstructure on dielectric strength of Cu-Cr contact materials in vacuum显示文摘	Ding B J Yang Z Wang X	1996	IEEE Transactions on Components Packaging and Manufacturing Technology A1996，19，10：	1
10	Thermal cycling analysis of flip-chip solder joint reliability 显示文摘	Pang J H L Chong D Y R Low T H	2001	Components and Packaging Technologies2001，24，4：	1
11	The Effect of Material Transfer in Relays Diagnosed by Force and/or Voltage Measurement显示文摘	NEUHAUS A R RIEDER W F	2004	IEEE Transactions on Components and Packaging Technologies2004，27，1：	1
12	Transition from the Anodic Arc Phase to the Cathodic Metallic Arc Phase in Vacuum at Low DC Electrical LeveI显示文摘	Ben Jemma N Morin L	2002	IEEE Transactions on Components Packaging Technologies2002，25，4：	1
13	Heat transfer analysis and simplified termal resistance modeling of linear motor driven stages for SMT applications显示文摘	Jang Changsoo Kim Jong Young Kim Yung Joon	2003	IEEE Transactions on Components and Packaging Technologies2003，26，3：	1
14	Effect of Surface Roughness on Paper Substrate Circuit Board显示文摘	Ryan A and Lewis H	2012	IEEE Transactions on Components Packaging and Manufacturing Technology2012，2，7：	1
15	Comparison of Micro-PinFin and Micro-channel Heat Sinks Considering Thermal-Hydraulic Performanceand Manufacturability显示文摘	Benjamin A J Yongho J Kevin T	2010	IEEE Transactions on Components and Packaging Technology2010，33，1：	1
16	Capacitive pressure sensor with very large dynamic range 显示文摘	Bakhoum E G Cheng M H M	2010	IEEE Transactions on Components and Packaging Technology2010，33，1：	1
17	Nondestructive detection of defects in miniatur- ized multilayer ceramic capacitors using digital speckle correlation techniques 显示文摘	Chan Y C Yeung F Jin G	1995	Components Packaging and Manufacturing Technology Part A IEEE Transactions on1995，18，3：	1
18	Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism显示文摘	DUDEK R BEREK H FRITSCH T	2000	Components and Packaging Technologies2000，23，3：	1
19	A novel current limitation principle based on application of liquid metals显示文摘	NIAYESH K TEPPER J KONIG F	2006	IEEE Trans on Components and Packaging Technology2006，29，2：	1
20	A structured approach for analysis of design processes显示文摘	ANDREW Kusiak JUITE Wang DAVID W He	1995	IEEE Transactions on Components Packaging and Manufacturing Technology(Part A)1995，18，3：	1

返回顶部每页显示：

共46页首页上一页第1页下一页末页 /46 跳转

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费

用户提示