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1811篇 您的检索式：期刊名="IEEE Packaging"

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	题名	作者	年代	出处	被引量
1	Magnetically ordered ferroelectric materials显示文摘	SKINNER S M	1970	IEEE Trans Parts Mater Packaging1970，6，：	2
2	Printed circuit board recycling: A state-of-the-art survey显示文摘	JIANGZHI L SHRIVASTAVA P ZONG G	2004	Electronics Packaging Manufacturing IEEE Transactions2004，27，1：	1
3	Errors associated with the design,calibration and application of piezoresistive stress sensors in(100)silicon 显示文摘		1994	IEEE Trans Components Packaging Manufacturing Technol1994，，：	1
4	Electrical conduction models for isotropically conductive adhesive joints显示文摘	MORRIS J E	1997	IEEE Transactions on Components Package Manufacturing Technology1997，20，1：	1
5	Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder Interface显示文摘	XU L H PANG J H L PRAKASH K H	2005	IEEE Transactions on Components and Packaging Technology2005，28，3：	1
6	Multi-Objective placement of electronic components using evolutionary algorithms显示文摘	DEB K JAIN P GUPTA N	2004	IEEE Transactions on Components and Packaging Technologies2004，27，3：	1
7	ESD Phenomena in GMR Heads in the Manufacturing Process of HDD and GMR Heads显示文摘	Matsugi Junya Mizoh Yoshiaki Nakano Taro	2005	IEEE Transaction on Electronics Packaging Manufacturing2005，28，3：	1
8	Modeling of simultaneous switching noise in high speed systems显示文摘	Chun S Swaminathan M	2001	IEEE Transactions on Advanced Packaging2001，24，2：	1
9	Frequency-dependent crosstalk simulation for on-chip interconnections 显示文摘	Deutsch A Smith H H	1999	IEEE Trans Advanced Packaging1999，22，3：	1
10	Rough Set Theory:a Data Mining Tool for Semiconductor Manufacturing显示文摘	Andrew Kusiak	2001	IEEE Transactions on Electronics Packaging Manufacturing2001，24，1：	1
11	Thermal simulation of switchgear显示文摘	Paulke J Weichert H Steinhaeuser P	2002	IEEE Transactions on Components and Packaging Technologies2002，25，3：	1
12	The development of Cu bond- ing wire with oxidation-resistant metal coating 显示文摘	Kaimori S Nonaka T Mizoguchi A	2006	IEEE Transaction onAdvanced Packaging2006，29，2：	1
13	Power Distribution Networks for System on Package: Status and Challenges 显示文摘	Swaminathan M Kim J Novak 1	2004	IEEE Transactions on Advanced Packaging2004，27，2：	1
14	Mechanism of electrical con- duction though anisotropically conductive adhesive films 显示文摘	Mizuno M Saka M Abe H	1996	IEEE Transactions on Components Packaging and Manufacturing Technology Part A1996，19，4：	1
15	Effect of the inlet location on the performance of parallel-channel cold-plate 显示文摘	High-performance heat Device Letters IEEE LU M C WANG C C	2006	IEEE Transactions on Components and Packaging Techno\|ogies2006，29，1：	1
16	Effects of Cu/Al intermetallic compound on copper wire and aluminum pad bondability显示文摘	Kim H J Lee J Y Paik K W	2003	IEEE Transactions on Components and Packaging Technology2003，26，2：	1
17	Influence of microstructure on dielectric strength of Cu-Cr contact materials in vacuum显示文摘	Ding B J Yang Z Wang X	1996	IEEE Transactions on Components Packaging and Manufacturing Technology A1996，19，10：	1
18	The Effect of Material Transfer in Relays Diagnosed by Force and/or Voltage Measurement显示文摘	NEUHAUS A R RIEDER W F	2004	IEEE Transactions on Components and Packaging Technologies2004，27，1：	1
19	Transition from the Anodic Arc Phase to the Cathodic Metallic Arc Phase in Vacuum at Low DC Electrical LeveI显示文摘	Ben Jemma N Morin L	2002	IEEE Transactions on Components Packaging Technologies2002，25，4：	1
20	A new bumping process using the lead- free solder paste 显示文摘	SUGA T SAITO K	2002	IEEE Transactions on Electronics Packaging Manufacturing2002，25，4：	1

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