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155篇 您的检索式：期刊名="Surface Mount Technology"

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	题名	作者	年代	出处	被引量
1	Fatigue crack growth behavior of lead-containing and lead-free solders 显示文摘	Mutoh Y Zhao J Miyashita Y	2002	Soldering and Surface Mount Technology2002，14，3：	1
2	显示文摘	Xie X M Chen L	2000	Soldering & Surface Mount Technology2000，12，3：	1
3	Analysis of crack growth in solder joints 显示文摘	Shangguan D K	1999	Soldering & Surface Mount Technology1999，11，3：	1
4	Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments显示文摘	ZENG G XUE S B ZHANG L	2010	Soldering & Surface Mount Technology2010，22，4：	1
5	A Review of the Advanced Packaging Technologies显示文摘	David R Hald	1997	Surface Mount Technologies1997，，9：	1
6	Microstmctural changes of lead-free solder joints during long-term ageing,thermal cycling and vibration fatigue显示文摘	ANDREAS R F WOLFGANG N JURGEN W	2008	Soldering & Surface Mount Technology2008，20，1：	1
7	A review of the advanced packaging technologies显示文摘	HALD D R	1997	Surface Mount Technologies1997，，9：	1
8	Analysis on solder bail shear testing conditions with a simple computational model 显示文摘	Lee R S W Huang X	2002	Soldering and Surface Mount Technology2002，14，1：	1
9	Characterization and analysis on the solder ball shear testing conditions显示文摘	Huang X J Lee S W R Yah C C	2002	Soldering and surface mount technology2002，14，1：	1
10	Drop test and Impact life prediction model for QFN packages 显示文摘	Tee T Y Ng H S Lim C T	2003	Journal of Surface Mount Technology2003，16，3：	1
11	A Review of the Advanced Packaging Technologies显示文摘		1997	Surface Mount Technologies1997，，9：	1
12	The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow显示文摘	Timo Liukkonen	2004	Soldering & Surface Mount Technology2004，161，：	1
13	Analysis on solder ball shear testing conditions with a simple computational model 显示文摘	Lee Ricky S W Huang X J	2002	Soldering & Surface Mount Technology2002，4，1：	1
14	Process and pad design optimization for 01005 passive component surface mount assembly显示文摘	Wang Y Olorunyomi M Dahlberg M	2007	Soldering&Surface Mount Technology2007，19，1：	1
15	Effect of bulk Cu6Sn5 intermetallic compounds on properties of Sn-Ag-Cu-Ce solder joints显示文摘	ZHANG Liang XUE Songbai GAO Lili	2011	Soldering & Surface Mount Technology2011，23，1：	1
16	Development and validation of lead-free wave soldering process显示文摘	Forsten A Steen H Wilding I	2000	Soldering& surface mount technology2000，12，3：	1
17	A Review of the Advanced Packaging Technologies 显示文摘	David R Hald	1997	Surface Mount Technologies1997，，9：	1
18	A Review of the Advanced Packaging Technologies显示文摘	David R Hald	1997	Surface Mount Technologies1997，，9：	1
19	The effect of Pb contamination on the mierostructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT显示文摘	ZHU Qi-nong SHENG Mei LUO Le	2000	Soldering & surface mount technology2000，12，3：	1
20	Degradation of flip-chip-on-glass intercon-nection with ACF under high humidity and thermal aging 显示文摘	WU C CHAUM	2002	Soldering & Surface Mount Technology2002，14，2：	1

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