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26篇 您的检索式：作者名="NAY H"

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	题名	作者	年代	出处	被引量
1	Identification of inorganic improvised explosive devices using sequential injection capillary electrophoresis and contactless conductivity detection显示文摘	Blanco G A Nai Y H Hilder E F	2011	Anal Chem2011，83，：	1
2	Total synthesis of ( + ) -compactin ( ML-236B ) 显示文摘	Nai Y W Chi T H Charles J S	1981	J Am Chem Soc1981，103，：	1
3	Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder显示文摘	Han Y D Jing H Y Nai S M L	2010	Journal of Electronic Materials2010，39，2：	1
4	Development and Fabrication of Cylindrical Silicon-on-Insulator Microdosimeter Arrays显示文摘	Nai S L Wee H L Ziebell A L		0，，03：	1
5	Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes显示文摘	HAN Y 0 JING H Y NAI S	2012	J Mater Sci Mater Electron2012，23，5：	1
6	Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder显示文摘	Han Y D Jing H Y Nai S M L	2010	Journal of Electronic Materials2010，39，2：	1
7	Measure for evaluating supply chain performance in transport logistics显示文摘	Lai K H Nai E W T Cheng T C E	2002	Transportation research part E2002，38，：	1
8	Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder显示文摘	HAN Y 0 JING H Y NAI S	2010	J Electron Mater2010，39，2：	1
9	Temperature dependenceof creep and hardness of Sn-Ag-Cu lead-free solder显示文摘	HAN Y D JINC H Y NAI S M L	2010	Journal ofElectronic Materials2010，39，2：	1
10	Effect of Ni-eoated carbon nanotubes on interfa- cial reaction and shear strength of Sn-Ag-Cu solder joints 显示文摘	Hart Y D Jing H Y Nai S M L Xu L Y Tan C M Wei J	2012	Journal of Electronic Materials2012，41，9：	1
11	Low temperature wafer anodic bonding显示文摘	Wei J Xie H Nai M L	2003	Journal of Micromechanics and Microengineering2003，13，：	1
12	Interface tailoring to enhance mechanical properties of carbon nanotube reinforced magnesium composites 显示文摘	NAI M H WEI J GUPTA M	2014	Materials & Design2014，60，：	1
13	Indentation Size Effect on the Creep Behavior of a SnAgCu Solder 显示文摘	HAN Y D JING H Y NAI S M L	2010	International Journal of Modem Physics B2010，24，0102：	1
14	Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling显示文摘	Han Y D Jing H Y Nai S M L	2012	Intennetallics2012，31，：	1
15	Creep mitigation in Sn-Ag- Cu composite solder with Ni-coated carbon nanotubes显示文摘	Han Y D Jing H Y Nai S M L	2012	Journal of Materials Science: Materials In Electronics2012，，23：	1
16	I'm~nobilizafion of protein kinase C into cypovirus polyhedra显示文摘	IJIRI I-I NAI~A'T~NI T IDO H	2010	Journal of insect biotechnology & sericology2010，79，：	1
17	Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling显示文摘	Han Y D Jing H Y Nai S M L	2012	Interme- tallics2012，31，：	1
18	Synthesis of Mg2B2O5 whiskers via eoprecipitation and sintering process 显示文摘	Zhu D H Nai X Y Zhu C C	2012	In- ternational Journal of Mineralc Metallurgy and Materials2012，19，10：	1
19	Effects of short - term treatment of nicorandil on exercise - induced myocardial ischemia and abnormal cardiac autonomic activity in micrcvascular angina 显示文摘	Jaw - Wen C Wen - Lieng L Nai - Wei H	1997	The American Journal of Cardiology1997，80，1：	1
20	Low complexity per-antenna rate and power control approach for closed-loop V-BLAST显示文摘	Zhuang H R nai L Zhou S D	2003	IEEE Transactions on Communications2003，51，11：	1

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