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37篇 您的检索式：作者名="TEE Y H"

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	题名	作者	年代	出处	被引量
1	Board level solder joint relia- bility modeling and testing of TFBGA packages for telecom- munication applications 显示文摘	Tee T Y Ng H S Yap D	2003	Microelectronics Reliability2003，43，7：	1
2	Formation of Colloidal CuO Nanocrystallites and Their Spherical Aggregation and Reductive Transformation to Hollow Cu20 Hollow Nanospheres显示文摘	Chang Y Tee J Zeng H C	2005	Langrnuir2005，21，：	1
3	Genetic polymor phism of urokinase type plasminogen activator is interacting with plasminogen activator inhibito>1 to raise risk of cervical neoplasia显示文摘	Tee Y T Wang P H Tsai H T	2012	J Surg Oncol2012，106，2：	1
4	Drop test and Impact life prediction model for QFN packages 显示文摘	Tee T Y Ng H S Lim C T	2003	Journal of Surface Mount Technology2003，16，3：	1
5	Color and power Doppler twin kling artifacts from urinary atones显示文摘	Tee J Y Kim S H Cho J Y		0，，176：	1
6	Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications 显示文摘	Tee T Y Ng H S Yap D	2003	Microelectronics Reliability2003，43，7：	1
7	Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications显示文摘	Tee T Y Ng H S Yapa D	2003	Mieroelectronics Reliability2003，43，7：	1
8	What goes around comes around: How meso - level negative emotional contagion can ultimately determine organizational attitudes toward leaders 显示文摘	Dasborough M T Ashkanasy N M Tee E Y J Tse H H M	2009	The Leadership Quarterly2009，，20：	1
9	Amniotic epithelial ceils from the human placenta potently suppress a rnouse model of multi pie sclerosis显示文摘	Liu Y H Vaghjiani V Tee J Y	2012	PLoS One2012，7，35：	1
10	Impact Life Prediction Modeling of TFBGA Packages Under Board Level Drop Test显示文摘	Tee T Y Ng H S et at	2004	Microelectronics Reliability2004，，：	1
11	Role of Ni/Fe nanoparticle com-position on the degradation of trichloroethylene from water显示文摘	Tee Y H Grulke E Bhattacharyya D	2005	Ind Eng Chem Res2005，44，：	1
12	What goes around comes around: How meso-level nega- tive emotional contagion can ultimately determine organiza- tional attitudes toward leaders 显示文摘	Dasborough M T Ashkanasy N M Tee E Y J Tse H H M	2009	The Leadership Quarter- ly2009，20，：	1
13	A tabu search algorithm for static routing and wavelength assignment problem显示文摘	Wang Y Tee H Meng H L	2005	IEEE Communication Letters2005，9，9：	1
14	Comprehensive board-level solder joint reliability modeling and testing of QFN and power QFN packages 显示文摘	Tee T Y Ng H S Yap D	2003	Microelectronies Reliability2003，43，8：	1
15	Board level solder joint reliability modeling of telecommunication appli- cations 显示文摘	Tee T Y Ng H S Yap D	2003	Microelectronics Reliability2003，43，7：	1
16	Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications显示文摘	Tee T Y Ng H S Yapa D	2003	Microelectronics Reliability2003，43，7：	1
17	Impact life pre- diction modeling of TFBGA packages under board level drop test 显示文摘	Tee T Y Ng H S Lim C T	2004	Microelectronics Reliability2004，44，7：	1
18	Comprehensive board-level solder joint reliability modeling and testing of QFN and power QFN packages显示文摘	TEE T Y NG H S YAP D	2003	Microelectronics Reliability2003，43，8：	1
19	Impact life prediction modeling of TFBGA packages under bpard level drop test 显示文摘	Tee T Y Ng H S Yap D	2004	Microelectronics Reliability2004，44，：	1
20	Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA 显示文摘	Tee T Y Ng H S Zhong Z W	2006	Microelectronics Reliability2006，46，12：	1

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