Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

查看全文 作　　者：Zhu, [1]Xiaoyun; Liu, [2]Yuanlong; Long, [1]Jinming; Liu, [1]Xiaoli

机构地区：School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China[1] Faculty of Metallurgy and Energy Engineering, Kunming University of Science and Technology, Kunming 650093, China[2]

出　　处：《Rare Metals》索引2012年第31卷第1期,共7页

基　　金：financially supported by the Special Funds of National Ministry of Finance for the Transformation of Industrial Technology Achievements (No.CJ2007-475) 摘　　要：The electrochemical migration (ECM) behavior of the electrically conductive adhesives (ECAs) filled with pure Ag powder or Ag-plated Cu composite powder with varied Ag:Cu ratios was investigated under the condition of applying constant voltage and distilled water environment.ECM resistance was determined from the current-time curves.The microstructure and composition of ECM dendrite products were analyzed by SEM/EDS and XRD.It was found that the ECM resistance of Ag-plated Cu composite powder-filled ECAs was evidently higher than that of pure Ag powder-filled ECAs.The Ag:Cu ratio of composite powder in ECAs had notable influence on ECM resistance,which was enhanced with the decrease of Ag:Cu ratios.The composition of dendrites formed between cathode and anode during ECM process was not uniform for Ag-plated Cu-filled ECAs.An ECM inhibiting mechanism of Ag-plated Cu composite powder was proposed according to analysis of the electrochemical impedance spectroscopy,Tafel plot and dendrite composition. 关键词：composite material electrochemical migration Ag-plated Cu composite powder electrically conductive adhesives

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Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

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