The optimization model of the heat conduction structure

查看全文 作　　者：Yongcun Zhang Shutian [1]Liu

机构地区：[1]State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, China

出　　处：《Progress in Natural Science:Materials International》索引2008年第18卷第6期,共6页

基　　金：the National Natural Science Foundation of China(Grant Nos. 10332010,10721062);the National Key Basic Research Program of China (Grant No.2006CB601205);the Program for New Century Excellent Talents in the University of China (2004). 摘　　要：An optimization model considering a novel thermal performance index to be the objective function is proposed for minimizing the highest temperature in this paper.Firstly,the performance of the conventional heat conduction optimization model,with the dissipation of heat transport potential capacity as the objective function,is evaluated by a one-dimensional heat conduction problem in a planar plate exchanger.Then,a new thermal performance index,named the geometric average temperature,is introduced.The new heat con-duction optimization model,with the geometric average temperature as the objective function,is developed and the corresponding finite element formula is presented.The results show that the geometric average temperature is an ideal thermal performance index and the solution of the new model is close to the theoretical optimal solution. 关键词：最佳化热传导结构电位容量

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The optimization model of the heat conduction structure

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