Multiscale simulation of nanometric cutting of single crystal copper——effect of different cutting speeds

查看全文 作　　者：Hongmin PEN Qingshun BAI Yingchun LIANG Mingjun [1]CHEN

机构地区：[1]School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China

出　　处：《Acta Metallurgica Sinica(English Letters)》索引2009年第22卷第6期,共7页

基　　金：supported by National Natural Science Foundation of China(Nos.50675050 and 50705023);Outstanding Youth Science Foundation of Hei-longjiang Province (No.JC200614) 摘　　要：A multiscale simulation has been performed to determine the effect of the cutting speed on the deformation mechanism and cutting forces in nanometric cutting of single crystal copper.The multiscale simulation model,which links the finite element method and the molecular dynamics method,captures the atomistic mechanisms during nanometric cutting from the free surface without the computational cost of full atomistic simulations.Simulation results show the material deformation mechanism of single crystal copper greatly changes when the cutting speed exceeds the material static propagation speed of plastic wave.At such a high cutting speed,the average magnitudes of tangential and normal forces increase rapidly.In addition,the variation of strain energy of work material atoms in different cutting speeds is investigated. 关键词：切割速度纳米切削单晶铜多尺度模拟分子动力学方法变形机制有限元方法

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Multiscale simulation of nanometric cutting of single crystal copper——effect of different cutting speeds

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