Ductility of metal thin films in flexible electronics

查看全文 作　　者：NIU [1]RongMei;LIU [1]Gang;DING [1]XiangDong;SUN [1]Jun 机构地区：[1]State Key Laboratory for Mechanical Behavior of Materials and School of Materials Science&Engineering,Xi’an Jiaotong University,Xi’an 710049,China 出　　处：《Science China(Technological Sciences)》索引2008年第51卷第11期,共9页 基　　金：the National Basic Research Program of China (Grant No. 2004CB619303);the 111 Project of China (Grant No. B06025);the Science and Technology Key Project from Ministry of Education of China (Grant Nos. 02182, 03182) 摘　　要：Flexible, large area electronics using various organic and inorganic materials are beginning to show great promise. During manufacture and service, large deforma- tion of these hybrid materials will pose significant challenges in terms of high performance and reliability. A deep understanding of the ductility or flexibility of macroelectronics becomes one of the major issues that must be addressed ur- gently. This paper describes the current level of understanding on the thin-film ductility, both free-standing and substrate-supported, and relevant influencing factors. 关 键 词：THIN FILMS DEFORMATION flexible ELECTRONICS