DIFFUSION BONDING OF TiAl TO Ti AND TC4 ALLOY

查看全文 作　　者：P. He;J. H. Zhang;J. C. Feng and Y. Y. Qian (National Key Laboratory of Advanced Welding Production Technology, HIT, Harbin 150001, China) 出　　处：《Acta Metallurgica Sinica(English Letters)》索引2000年第13卷第1期,共6页 摘　　要：TiAl was diffusion bonded to Ti and TC4 alloy in vacuum furnace. Results showed,at the TiAl-Ti interface,the reaction layer of stratification Ti3Al was formed closest to TiAl base,and the a phase and the α + βphase arised closest to Ti base at 1173K and 1573K respectively. The phase structure of TiAl/ and the phase structure of TiAlwere observed be- tween AiAl and TC4 under respetive bonding temperature.The fiacture at tensile testing occurred in the bond - line, producing very flat fracture surfaces with some pull-out of the TiAl materials.The ultimate tensile strengths of the joint were approximate to γ-TiAl base marterial. 关 键 词：DIFFUSION BONDING INTERFACE reacting TIAL