Electrodeposition of aluminium and aluminium-copper alloys from a room temperature ionic liquid electrolyte containing aluminium chloride and triethylamine hydrochloride

查看全文 作　　者：P.V. [1]Suneesh;T.G. Satheesh [1]Babu;T. [1]Ramachandran

机构地区：[1]Department of Sciences, Amrita School of Engineering, Amrita Vishwa Vidyapeetham, Amritanagar P. O.Coimbatore - 641112,India

出　　处：《International Journal of Minerals,Metallurgy and Materials》索引2013年第20卷第9期,共8页

基　　金：financial support from ISRO under RESPOND scheme(No.ISRO/RES/3/580/2007-08) 摘　　要：The electrodeposition of Al and Al-Cu binary alloys on to gold substrates from a room temperature ionic liquid electrolyte containing AlCl3-Et3NHCl was studied.The electrochemical behavior of the electrolyte and the mechanism of deposition were investigated through cyclic voltammetry(CV),and the properties of deposits obtained were assessed by scanning electron microscopy with energy dispersive X-ray spectroscopy(SEM-EDS) and X-ray difraction(XRD).Al of 70 μm in thickness and an Al-Cu alloy of 30 μm in thickness with 8at% copper were deposited from the electrolyte.SEM images of the deposits indicate that the Al deposit was smooth and uniform,whereas the Al-Cu deposit was nodular.The average crystalline size,as determined by XRD patterns,was found to be(30 ± 5) and(29 ± 5) nm,respectively,for Al and Al-Cu alloys.Potentiodynamic polarization(Tafel plots) and electrochemical impedance spectroscopic(EIS) measurements showed that Al-Cu alloys are more corrosion resistant than Al. 关键词：合金电沉积液体电解质铜合金三乙胺盐酸盐铝铜离子室温 SEM-EDS

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Electrodeposition of aluminium and aluminium-copper alloys from a room temperature ionic liquid electrolyte containing aluminium chloride and triethylamine hydrochloride

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