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Construction of all-organic low dielectric polyimide hybrids via synergistic effect between covalent organic framework and cross-linking structure

查看全文 作　　者：Wanjing [1]Zhao;Zhaoyang [2]Wei;Chonghao [1]Lu;Yizhang [1]Tong;Jingshu [1]Huang;Xianwu [1]Cao;Dean [2]Shi;Robert [3]KYLi;Wei [4]Wu 高影响力作者 机构地区：[1]Key Laboratory of Polymer Processing Engineering of Ministry of Education,Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing,School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou,510640,China;[2]Hubei Collaborative Innovation Center for Advanced Organic Chemical Materials,Ministry of Education Key Laboratory for the Green Preparation and Application of Functional Materials,Hubei Key Laboratory of Polymer Materials,Faculty of Materials Science and Engineering,Hubei University,Wuhan,430062,China;[3]Department of Materials Science and Engineering,City University of Hong Kong,Tat Chee Avenue,Kowloon,Hong Kong Special Administrative Region of China;[4]Jihua Laboratory,Foshan,528200,China高影响力机构 出　　处：《Nano Materials Science》索引2023年第5卷第4期,共10页高影响力期刊 基　　金：supported by National Natural Science Foundation of China(52103029 and 51903075). 摘　　要：Polyimide(PI)is a promising electronic packaging material,but it remains challenging to obtain an all-organic PI hybrid film with decreased dielectric constant and loss without modifying the monomer.Herein,a series of allorganic PI hybrid films were successfully prepared by introducing the covalent organic framework(COF),which could induce the formation of the cross-linking structure in the PI matrix.Due to the synergistic effects of the COF fillers and the cross-linking structure,the PI/COF hybrid film containing 2 wt%COF exhibited the lowest dielectric constant of 2.72 and the lowest dielectric loss(tanδ)of 0.0077 at 1 MHz.It is attributed to the intrinsic low dielectric constant of COF and a large number of mesopores within the PI.Besides,the cross-linking network of PI prevents the molecular chains from stacking and improves the fraction of free volume(FFV).The molecular dynamics simulation results are well consistent with the dielectric properties data.Furthermore,the PI/COF hybrid film with 5 wt%COF showed a significant enhancement in breakdown strength,which increased to 412.8 kV/mm as compared with pure PI.In addition,the PI/COF hybrid film achieve to reduce the dielectric constant and thermal expansion coefficient(CTE).It also exhibited excellent thermal,hydrophobicity,and mechanical performance.The all-organic PI/COF hybrid films have great commercial potential as next-generation electronic packaging materials. 关 键 词：POLYIMIDE Covalent organic framework All-organic Cross-linking structure Dielectric property Hybrid film
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