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104篇 您的检索式：期刊名="Circuit world"

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	题名	作者	年代	出处	被引量
1	RecYcling technologies for the treatment of end of life printed circuit boards (PCBs)显示文摘	GOOSEY M KELLNER R	2003	Circuit World2003，29，3：	1
2	High density metal coreprinted circuit boards显示文摘	Morisaki G Sato T Kikuchi H	1981	Circuit World1981，8，1：	1
3	New epoxy resins for printed wiring board applications显示文摘	Bernd Hoevel etc	2007	Circuit World2007，5，：	1
4	Minimization of tin whisker formation for lead-free electronics finishing显示文摘	Rob Schetty	2001	Circuit World2001，27，2：	1
5	Recycling technologies for the treatment of end of life printed circuit boards (PCBs) 显示文摘	GOOSEY M KELLNER R	2003	Circuit World2003，29，3：	1
6	Flaw detection on FPC solder surface 显示文摘	Ye Feng Li Di Huang Jiexian	2012	Circuit World2012，38，3：	1
7	Inner-layer copper reliability of electroless copper processes显示文摘	Li Crystal P L Ciccolo Paul Yee Dennis K W	2010	Circuit World2010，，1：	1
8	New halogen-free materials for PWB, HDI and advanced package substrate 显示文摘	Murai H Takeda Y Takano N	2001	Circuit World Part 22001，27，：	1
9	Recycling technologies for the treatment of end of life printed circuit boards (PCBs) 显示文摘	Martin Goosey Rod Kellner	2003	Circuit World2003，29，3：	1
10	Recycling technologies for the treatment of end of life printed circuit boards 显示文摘	Goosey M Kellner R	2003	Circuit World2003，29，：	1
11	Lead,halogen-free laminates and their effect on desmearing and metallization显示文摘	Neil Patton	2007	Circuit World2007，5，：	1
12	Printed circuit boards for lead-free soldering:materials and failure mechanisms显示文摘	Per Johander etc	2007	Circuit World2007，5，：	1
13	A solution for PCB drilling with strict requirement on hole wall quality显示文摘	Fu L Yang F	2008	CIRCUIT WORLD2008，34，2：	1
14	Recycling Technologies for the Treatment of End of Life Printed Circuit Boards (PCBs)显示文摘	Goosey M Kellner R	2003	Circuit World2003，29，3：	1
15	An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance显示文摘	Vianco P T	1999	Circuit World1999，25，1：	1
16	Micro LrHMW-PE column array molded by the utilization of PCB as mold insert 显示文摘	Liang X Li B Wu X Y	2013	Circuit World2013，39，：	1
17	Temperature cycling effects in some glob top polymer materials显示文摘	KHOO C G L LIU J	1998	Circuit World1998，24，4：	1
18	Copper electroplating technology for microvia filling显示文摘	Mark Lefebvre George Allardyce	2003	Circuit World2003，，2：	1
19	Recycling technologies for the treat- ment of end of life printed circuit boards (PCBs) 显示文摘	Goosey M Kellner R	2003	Circuit World2003，29，3：	1
20	Experiences with peel strength 显示文摘	Rudolf Wiechmann	2006	Circuit World2006，32，3：	1

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