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826篇 您的检索式：期刊名="Electron Packag"

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	题名	作者	年代	出处	被引量
1	Drop on Demand Solder Droplet Jetting System for Fabricating Microstructure显示文摘	LEE T M KANG T G YANG J S	2008	Electronics Packaging Manufacturing2008，31，3：	1
2	Printed circuit board recycling: A state-of-the-art survey显示文摘	JIANGZHI L SHRIVASTAVA P ZONG G	2004	Electronics Packaging Manufacturing IEEE Transactions2004，27，1：	1
3	ESD Phenomena in GMR Heads in the Manufacturing Process of HDD and GMR Heads显示文摘	Matsugi Junya Mizoh Yoshiaki Nakano Taro	2005	IEEE Transaction on Electronics Packaging Manufacturing2005，28，3：	1
4	Rough Set Theory:a Data Mining Tool for Semiconductor Manufacturing显示文摘	Andrew Kusiak	2001	IEEE Transactions on Electronics Packaging Manufacturing2001，24，1：	1
5	Investigation of a new lead free solder alloy using thin strip specimens显示文摘	Ren W Qian Z Lu M	1999	ASME Journal of Electronic packaging1999，121，：	1
6	Effects of Immersion zincation to the Electroless Nickel Under- Bump Materials in Microelectronics Packaging 显示文摘	Ng W C	1998	Proceedings of the Electronic Packaging Technology Conference1998，8，10：	1
7	Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy显示文摘	Shi X Q Zhou W Pang H L J	1999	ASME:Journal of Electronic Packaging1999，121，：	1
8	Characterization of the Solder Paste Release from Small Stencil Apertures in theStencil Printing Process 显示文摘	SrinivasaAravamudhan DarylSantos	2005	Journal of Electronic Packaging2005，，127：	1
9	Metal foam and finned metal foam heat sinks for electronics cooling in buoyancy-induced convection显示文摘	Bhattacharya A Mahajan R L	2006	Journal of electronic packaging2006，128，3：	1
10	The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging 显示文摘	WONG E H RAJOO R KOH S W	2002	Journal of Electronic Packaging2002，124，6：	1
11	Experimental study of void formation in eutectic and lead-free solder bumps of flip-chip assemblies 显示文摘	Wang D J Panto R L	2006	Journal of Electronic Packaging2006，128，：	1
12	A new bumping process using the lead- free solder paste 显示文摘	SUGA T SAITO K	2002	IEEE Transactions on Electronics Packaging Manufacturing2002，25，4：	1
13	BGAs for High Reliabity Applications显示文摘	Reza Gbaffarian	1998	Electronic Packaging&Production1998，，8：	1
14	Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy显示文摘	Shi X Q Zhou W Pang H L J	1999	ASME Journal of Electronic Packaging1999，121，：	1
15	Evaluation and optimization of package processing and design through solder joint profile prediction显示文摘	Yeung B H Lee T Y T	2003	Electronic Packaging Manufacturing2003，26，1：	1
16	Comprehensive treatment of moisture induced failure in IC packaging 显示文摘	WONG E H KOH S W LEE K H	2002	IEEE Transactions on Electronics Packaging Manufacturing2002，25，3：	1
17	The changing automotive environment: high-temperature electronics 显示文摘	Johnson R W Evans J L Jacobsen Peter	2004	IEEE transactions on electronics packaging manufacturing2004，27，3：	1
18	Finite element method for predicting equilibrium shapes of solder Joint显示文摘	Nigro N J	1993	ASME Journal of Electronic Packaging1993，115，6：	1
19	AlN steps up,takes the heat and delivers显示文摘	Hodson Tirnothy	1997	Electronic Packaging and Production1997，37，3：	1
20	Systematic study on thermo-mechanical durability of Pb-free assemblies :experiments and FE analysis显示文摘	Zhang Q Dasgupta A Nelson D	2005	Journal of Electronic Packaging2005，127，4：	1

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