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15篇 您的检索式：作者名="RAJOO R"

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		题名	作者	年代	出处	被引量
	1	The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging 显示文摘	WONG E H RAJOO R KOH S W	2002	Journal of Electronic Packaging2002，124，6：	1
	2	Engine turbocharger performance prediction:One-dimensional modeling of a twin entry turbine显示文摘	Chiong M S Rajoo S Martinez-Botas R F	2012	Energy Conversion and Management2012，57，：	1
	3	Moisture absorption and diffusion characterisation of packaging materials--Advanced treatment显示文摘	Wong E H Rajoo R	2003	Microelectronics Reliability2003，43，12：	1
	4	The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging 显示文摘	Wong E H Rajoo R Koh S W	2002	J Electron Packg2002，124，6：	1
	5	Trends and challenges of environmentally friendly laminates显示文摘	Wong E H Rajoo R	2003	Printed Circuit Fabrication2003，，3：	1
	6	Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives显示文摘	Zhang X W Wong E H Rajoo R	2005	Microelectronies Reliability2005，45，78：	1
	7	Unsteady performance analysis of a twin-entry variable geometry turbocharger turbine显示文摘	Rajoo Srithar Romagnoli A Martinez-Botas R F	2012	Energy2012，38，：	1
	8	Engine turbocharger performance prediction: One-dimensional modeling of a twin entry turbine显示文摘	Chiong M S Rajoo S Martinez-Botas R F	2012	Energy Conversion and Management2012，57，：	1
	9	The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging 显示文摘	Wong E H Chan K C Rajoo R	2000	IEEE2000，，9：	1
	10	Stability Analysis and Stability Chart for Unsaturated Residual Soil Slope显示文摘	FAISAL H A HUAT B B K RAJOO R S K	2006	American Journal of Environmental Science2006，2，4：	1
	11	The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging 显示文摘	Wong E H Rajoo R Koh S W	2002	J Electron Packg2002，124，16：	1
	12	Moisture absorption and diffusion characterization of packaging materials-advanced trealment显示文摘	WONG E H RAJOO R	2003	Microelectronic Reliability2003，33，4：	1
	13	Modeling stress in silicon with TSVs and its effect on mobility 显示文摘	SELVANAYAGAM C ZHANG X W RAJOO R	2011	IEEE Transactions on Components Packaging and Manufacturing Technology2011，1，9：	1
	14	Development of process modeling methodology for flip chip on flex interconnections with non - conductive adhesives 显示文摘	ZHANG X W WONG E H RAJOO R	2005	Microelectronics Reliability2005，45，78：	1
	15	The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging 显示文摘	Wong E H Rajoo R Koh S W	2002	J Electro Packg2002，124，：	1

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