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43篇 您的检索式：期刊名="IEEE Trans CPMT"

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	题名	作者	年代	出处	被引量
1	Electric Contact Materials and Their Erosion in Automotive DC Relays显示文摘	Chi Leung H Anthony Lee	1992	IEEE Trans on CPMT1992，15，2：	1
2	Physical and Chemical Properties of Metal Oxide Additions to Ag-SnO2 Contact Material and Predictions Electrical Performance显示文摘	Didier Jennot Jacques Pinard Pierre Ramoni	1994	IEEE Trans on CPMT1994，17，1：	1
3	Fatigue life of leadless chip carrier solder joints during power cycling 显示文摘	Engelmaier W	1983	IEEE Trans CPMT1983，6，3：	1
4	The Preparation and Properties of Microcrystalline and Nanocrystalline CuCr Contact Materials显示文摘	Wang Yaping Ding Bingjun	1999	IEEE Trans on CPMT1999，22，3：	1
5	Effects of solder joint shape and height on thermal fatigue lifetime 显示文摘	Liu X S Lu G Q	2003	IEEE Trans CPMT2003，26，2：	1
6	Effective erosion rate for selected contact material in low voltage contactors显示文摘	Schulman M B Slade P G Loud L D Li W	1995	IEEE Trans on CPMT1995，18，2：	1
7	Advances in material development for high power vacuum interrupter contacts 显示文摘	Slade P G	1994	IEEE Trans on CPMT1994，17，1：	1
8	Advances in material development for high power vacuum interrupter contacts显示文摘	Slade P G	1994	IEEE Trans on CPMT1994，17，1：	1
9	Fatigue Life of Leadless Chip Carriers Sol- der Joints during Power Cycling显示文摘	ENGELMAIER W	1983	IEEE Trans CPMT1983，6，23：	1
10	Influence of microstructure on dielectric strength of CuCr contact materials in a vacuum显示文摘	Ding Bingjun Yang Zhimao Wang Xiaotian	1996	IEEE Trans on CPMT1996，19，1：	1
11	A novel lightweight packaging technology 显示文摘	JACOBSON D M SANGHA S P S	1998	IEEE Trans CPMT - A1998，21，3：	1
12	Influence of microstructure on Dielectric strength of CuCr Contact materials in a vacuum 显示文摘	Ding B J Yang Z M Wang X T	1996	IEEE Trans on CPMT1996，19，1：	1
13	The Influence of Composilion and Cr Particle Size of Cu/Cr Contacts on Chopping Currents Contact Resistance, and Breakddown Voltage in Vacuum Interrupters显示文摘	Werner F Rider er al	1989	IEEE Trans on CPMT1989，12，2：	1
14	Physical and Chemical Properties of Metal Oxide Addition to Ag/SnO2 Contact Materials and Predicitions of Electrical Performance显示文摘	JEANNOT D PINARD J	1994	IEEE Trans on CPMT1994，17，1：	1
15	A stair-like CIM system architecture显示文摘	Chen Y L Tseng M M	1997	IEEE Trans on CPMT Part C Manufacturing1997，20，2：	1
16	A transmission electron microscopy study of ultrasonic wire bonding 显示文摘	James E Krzanowski	1990	IEEE Trans CPMT1990，13，1：	1
17	Physical and Chemical Properties of Metal Oxide Additions to Ag-SnO2 Contact Material and Predictions Electrical Performance显示文摘	Jacques Pinard and Pierre Ramoni etc	1994	IEEE Trans on CPMT Part A1994，17，1：	1
18	Make and break erosion of Ag/MeO contact materials 显示文摘	Engelert Hetzmannseder Wemer F Rieder	1996	IEEE Trans on CPMT Part A1996，19，3：	1
19	Make-and Break Erosion of Ag/MeO Contact Materials显示文摘	Werner F Rieder	1996	IEEE Trans on CPMT Part A1996，19，3：	1
20	Gold wire bonding onto flexible polymeric substrates显示文摘	Lyons A M Weld J D	1996	IEEE Trans CPMT Part A1996，19，1：	1

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