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16篇 您的检索式:作者名="Avram B"
    题名 作者 年代 出处 被引量
1Thermal compact modeling of parallel plate heat sinks显示文摘Sridhar N Avram B Rajesh N 2003IEEE Transaction on Components and Packaging Technologies2003,26,1:1
2Design of optimum plate-fin natural convective heat sinks 显示文摘Avram B C Lyengar M Kraus A D 2007ASME J Electron Packg2007,,125:1
3Late Na current inhibi- tion by ranolazine reduces torsades de pointes in the chronic at rioventricular block dog model显示文摘Gudruna A Avram O Luiz B 2010J Am Coil Cardiol2010,55,8:1
4RENAAL Study:analysis of metabolic parameters as predictors of risk in the RENAAL study显示文摘 Radhakrishnan J Avram M M 2003Diabetes Care2003,26,5:1
5Fatigue crack growth analysis of stiffened cracked panel repaired with bonded composite patch显示文摘Sabelkin V Mall S Avram J B 2006Engineering Fracture Mechanics2006,,73:1
6Analytical modeling of silicon thermoelectric micro-cooler 显示文摘Wang P Avram B C Yang B 2006J Appl Phys2006,100,:1
7Design for manufacturability of SISE parallel plate forced convection heat sinks显示文摘MADHUSUDAN I AVRAM B C 2001IEEE Transactions on Components and Packing Technologies2001,24,2:1
8Thermal characterization of chip packages-evolutionary development of compact models显示文摘Avram Bar-Cohen William B Krueger 1997IEEE Trans Compon Packg Manuf Technol-part1997,20,4:1
9Fatigue crack growth analysis of stiffened cracked panel repaired with bonded composite patch显示文摘Sabelkin V Mall S Avram J B 2006Engineering Fracture Mechanics2006,,73:1
10Phase-type approximations to finite-time ruin probabilities in the Sparre Andersen and stationary renewal risk models 显示文摘STANFORD D A AVRAM F BADESCU A B 2005Astin Bull2005,35,1:1
11Thermal design and optimization of natural convection polymer pin fin heat sinks 显示文摘Raj B Avram B C 2005IEEE Transactions on Components and Packaging Technologies2005,28,2:1
12Fatigue crack growth analysis of stiffened cracked panel repaired with bonded composite patch 显示文摘SABELKIN V MALL S AVRAM J B 2006Composite Structures2006,73,11:1
13Thermal design and optimization of natural convection polymer pin fin heat sinks显示文摘Raj B Avram B C 2005IEEE Transactions on Components and Packaging Technologies2005,28,2:1
14Thermoelectricpowered convective cooling of microprocessors 显示文摘KAZUAKI Y GARY L S AVRAM B C 2005IEEE Transaction on Advanced Packaging2005,28,2:1
15Analysis of inetabolic parameters as predictors of risk in the RF, NAAI, study显示文摘Appel G B Radhakrishnan J Avram M M 2003Diabetes Care2003,26,:1
16显示文摘Catherine M S Avram M B 2007J Phys Chem A2007,111,13:1
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