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2篇 您的检索式:作者名="B.Ashok"
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1搅拌铸造AA6061-T6/AlN_p复合材料的干滑动磨损行为(英文)显示文摘以AA6061为基体、AlN颗粒为增强体,采用搅拌铸造工艺得到AA6061-T6/AlNp复合材料,研究了AA6061-T6/AlNp复合材料的干滑动磨损行为。开发回归模型来预测复合材料的磨损率。采用四因素、五水平的正交实验进行优化。实验因素包括滑动速度、滑动距离、荷载、增强体AlN颗粒的质量分数。采用SYSTAT 12软件和统计工具,如方差分析(方差分析)和t实验,验证回归模型。结果表明,开发的回归模型可以有效预测复合材料的磨损率,置信度达95%。采用回归模型,并依据磨损表面形貌分析,预测实验因素对AA6061-T6/AlNp复合材料磨损率的影响。回归模型预测结果表明,复合材料的磨损率随着增强体AlN质量分数的增加而降低,随着滑动速度、滑动距离、荷载的增加而增加。B.ASHOK KUMAR N.MURUGAN I.DINAHARAN 2014Transactions of Nonferrous Metals Society of China2014,24,9:1
2Modification of tamarind fruit shell powder with in situ generated copper nanoparticles by single step hydrothermal method显示文摘Tamarind fruit shell powder(TFSP)with particle size of<50μm(obtained from cleaned tamarind fruit shells)was modified with in situ generated copper nanoparticles(CuNPs)by simple one step hydrothermal method.The modified TFSP was characterized by scanning electron microscope(SEM),Fourier transform infrared(FT-IR)spectroscopy,X-ray diffraction(XRD),thermogravi-metric analysis(TGA)and antibacterial tests.The generated stable CuNPs on the surface of the modified TFSP were spherical in shape with an average size of 88 nm.The FT-IR spectroscopy analysis indicated the involvement of the functional groups of the TFSP in the generation and stabilization of the CuNPs.The XRD analysis indicated the presence of both CuNPs and Cu 2 O nanoparticles in the modified TFSP.The thermal analysis indicated the presence of 5.6 wt%of copper nanoparticles as calculated from the difference of residual char content between the un-modified and modified TFSP.The modified TFSP with in situ generated CuNPs exhibited obvious antibacterial activity against both the Gram negative and Gram positive bacteria and hence can be considered as low cost filler in the preparation of antibacterial polymer hybrid nanocomposites for packaging and medical applications.B.Ashok N.Hariram Suchart Siengchin A.Varada Rajulu 2020Journal of Bioresources and Bioproducts2020,5,3:0
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