维普期刊资源整合服务平台（V6.5）

维普中文期刊产品整合服务

15篇 您的检索式：作者名="DENARDIS D"

选中清除导出查看参考文献查看引证文献引用追踪共1页首页上一页第1页下一页末页 /1 跳转

		题名	作者	年代	出处	被引量
	1	A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry 显示文摘	DENARDIS D ROSALES-YEOMANS D BORUCKI L et al	2011	Thin Solid Films2011，518，14：	1
	2	A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry 显示文摘	DENARDIS D ROSALES-YEOMANS D BORUCKI L	2011	Thin Solid Films2011，518，14：	1
	3	Hepatic interstitial laser photocoagulation: An investigation of the relationship between acute thermal lesions and their sonographic images显示文摘	Malone D E Wyman D R DeNardi FG et ol	1994	Invest Radiol1994，29，10：	1
	4	Cellular variant of extraskeletal myxoid chondrosarcoma with Ewing's sarcoma-like areas:a diagnostic pitfall in core needle biopsy显示文摘	El Demellawy D Denardi F Alowami S	2010	Pol J Pathol2010，61，1：	1
	5	A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry显示文摘	DENARDIS D ROSALES-YEOMANS D BORUCKI L	2010	Thin Solid Films2010，518，14：	1
	6	Characterization of copper-hydrogen peroxide film growth kinetics 显示文摘	DENARDIS D ROSALES-YEOMANS D PHILIPOSSIAN L B A	2006	Thin Solid Films2006，513，31：	1
	7	Design and evaluation of pad grooves for copper CMP 显示文摘	YEOMANS D R DENARDIS D BORUCKI L	2008	Journal of the Electrochemical Society2008，155，10：	1
	8	Hepatic interstitial laser photocoagulation:An investigation of the relationship between acute thermal lesions and their sonographic images 显示文摘	Malone D E Wyman D R DeNardi F G	1994	Invest Radial1994，29，10：	1
	9	Arrhenius character- ization of ILD and copper CMP processes 显示文摘	Sorooshian J DeNardis D Charns L	2004	Journal of the Electrochemical Society2004，151，2：	1
	10	A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry 显示文摘	DENARDIS D ROSALES-YEOMANS D BORUCKI L		Thin Solid Films0，518，14：	1
	11	Design and evaluation of pad grooves for copper CMP显示文摘	YEOMANS D R DENARDIS D BORUCKI L	2008	Journal of the Electrochemical Society2008，155，10：	1
	12	Evaluation of pad groove design under reduced slurry flow rate conditions during copper CMP显示文摘	YEOMANS D R DENARDIS D BORUCKI L	2008	Journal of the Electrochemical Society2008，155，10：	1
	13	Characterization of copper-hydrogen peroxide film growth kinetics 显示文摘	DeNardis D Rosales-Yeomans D Borucki L Philipossian A	2006	Thin Solid Films2006，513，：	1
	14	Modeling copper CMP removal rate dependency on wafer pressure, velocity, and dissolved oxygen concentration显示文摘	DeNardis D Doi T Hiskey B	2006	Joumal of the Electrochemical Society2006，153，5：	1
	15	Tfibology and removal rate characteristics of abrasive-free slurries for copper CMP applications显示文摘	DeNardis D Sorooshian J Habiro M	2003	Jpn J Appl Phys2003，42，11：	1

返回顶部每页显示：

共1页首页上一页第1页下一页末页 /1 跳转

goolge学术搜索-维普

网站首页 | 关于我们 | 联系我们 | 产品服务 | 客服中心 | 广告服务 | 版权声明 | 网站联盟 | 友情链接 | 售卡网点

版权所有© 渝B2-20050021-1　渝公网安备 50019002500403号　违法和不良信息举报中心

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费