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32篇 您的检索式：作者名="GAIN A K"

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	题名	作者	年代	出处	被引量
1	Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball array packages显示文摘	Gain A K Chan Y C Sharif A	2009	Microelectronics Reliability2009，49，7：	1
2	Effect of nano A1203 additions on the microstrueture, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads显示文摘	Fouzder T Gain A K Chan Y C	2010	Microelectronics Reliability2010，50，12：	1
3	Effect of addi- lions of ZrO2 nano-particles on the microstrueture and shear strength of Sn-Ag-Cu sohter on Au/Ni metallized Cu pads 显示文摘	Gain A K Chan Y C Yung W K C	2011	Mieroeleetronies Reliability2011，51，12：	1
4	Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/ Cn ball grid array packages显示文摘	Gain A K Chan Y C Yung W K C	2009	Materials Science and Engineering B2009，162，2：	1
5	TEM micro - structurecharacterization of nano Ti02 coated on nano ZK), powdersand their photocatalvtic activity 显示文摘	Lee B T Han J K Gain A K	2006	Materials ljetters2006，60，1718：	1
6	Establishment of new and replacement World Health Organization International Biological Standards for human interferon alpha and omega显示文摘	Meager A Gaines Das R Zoon K	2001	Immunol Methods2001，257，：	1
7	Effect of nano Ni additions on the structure and properties of Sn-gZn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages显示文摘	Gain A K Chan Y C Yung W K C	2009	Materials Science and Engineering B2009，162，2：	1
8	The influence of addi- tion of A1 nano-particles on the microstructure and shear strength of eutecfic Sn-Ag-Cu solder on Au/Ni/metallized Cu pads 显示文摘	Gain A K Fouzder T Chart Y C	2010	Journal of Alloys and Compounds2010，506，1：	1
9	The influence of addition of A1 nano-particles on the microstrueture and shear strength of eutectic Sn-Ag Cu solder on Au/Ni metallized Cu pads 显示文摘	GAIN A K FOUZDER T CHAN Y C	2010	Journal of Alloys and Compounds2010，506，：	1
10	TEM microstructure characterization of nano TiO2 coated on nano ZrO2 powders and their photocatalytic activity显示文摘	Han J K Gain A K	2006	Materials Letters2006，60，1718：	1
11	The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder and AulNi metalized Cu pads显示文摘	Gain A K Fouzder T Chan Y C	2010	Journal of Alloys and Compounds2010，506，1：	1
12	Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball array packages显示文摘	Gain A K Chan Y C Sharif A	2009	Microelectronics Reliability2009，49，7：	1
13	The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads显示文摘	Gain A K Chan Y C	2012	Intennetallics2012，29，：	1
14	Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages显示文摘	GAIN A K CHAN Y C WINCO K C	2009	Materials Science and Engineering B2009，162，2：	1
15	The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metalized Cu pads显示文摘	GAIN A K FOUZDER T CHAN Y C	2010	Journal of Alloys and Compounds2010，506，1：	1
16	Effect of addition of ZrO2nano-particles on the microstructure and shearstrength of Sn-Ag-Cu solder on Au/Ni metalized Cu pads显示文摘	GAIN A K CHAN Y C YUNG W K C	2011	Microelectronics Reliability2011，51，12：	1
17	The influence of a small amount of Al and Ni nano-particles on the microstructure,kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads显示文摘	GAIN A K CHAN Y C	2012	Intermetallics2012，29，：	1
18	Effect of nano Ni additions on the structure and properties of Sn-Zn-3Bi solder in Au/Ni/Cu ball grid array packages显示文摘	Gain A K Chan Y C Yung K C		0，，：	1
19	Effect of nano Ah03 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on AulNi metalized Cu pads显示文摘	Fouzder T Gain A K Chan Y C et a1	2010	Microelectronics Reliability2010，50，12：	1
20	Effect of additions of ZrO2nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metalized Cu pads显示文摘	GAIN A K CHAN Y C YUNG W K C	2011	Microelectronics Reliability2011，51，12：	1

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