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| 1 | Estimation of Transverse Thermal Conductivity of Doubly-periodic Fiber Reinforced Composites显示文摘For steady-state heat conduction,a new variational functional for a unit cell of composites with periodic microstructures is constructed by considering the quasi-periodicity of the temperature field and in the periodicity of the heat flux fields.Then by combining with the eigenfunction expansion of complex potential which satisfies the fiber-matrix interface conditions,an eigenfunction expansion-variational method(EEVM) based on a unit cell is developed.The effective transverse thermal conductivities of doubly-periodic fiber reinforced composites are calculated,and the first-order approximation formula for the square and hexagonal arrays is presented,which is convenient for engineering application.The numerical results show a good convergency of the presented method,even though the fiber volume fraction is relatively high.Comparisons with the existing analytical and experimental results are made to demonstrate the accuracy and validity of the first-order approximation formula for the hexagonal array. | Yan Peng Jiang Chiping Song Fan Xu Xianghong | 2010 | Chinese Journal of Aeronautics2010，23，1： | 5 |
| 2 | EXACT SOLUTION FOR ORTHOTROPIC MATERIALS WEAKENED BY DOUBLY PERIODIC CRACKS OF UNEQUAL SIZE UNDER ANTIPLANE SHEAR显示文摘Orthotropic materials weakened by a doubly periodic array of cracks under far-field antiplane shear are investigated,where the fundamental cell contains four cracks of unequal size. By applying the mapping technique,the elliptical function theory and the theory of analytical function boundary value problems,a closed form solution of the whole-field stress is obtained. The exact formulae for the stress intensity factor at the crack tip and the effective antiplane shear modulus of the cracked orthotropic material are derived. A comparison with the finite element method shows the effciency and accuracy of the present method. Several illustrative examples are provided,and an interesting phenomenon is observed,that is,the stress intensity factor and the dimensionless effective modulus are independent of the material property for a doubly periodic cracked isotropic material,but depend strongly on the material property for the doubly periodic cracked orthotropic material. Such a phenomenon for antiplane problems is similar to that for in-plane problems. The present solution can provide benchmark results for other numerical and approximate methods. | Junhua Xiao Chiping Jiang | 2009 | Acta Mechanica Solida Sinica2009，22，1： | 4 |
| 3 | A SCREW DISLOCATION IN A THREE-PHASE COMPOSITE CYLINDER MODEL WITH INTERFACIAL RIGID LINES显示文摘The problem of the elastic interaction between a screw dislocation and a threephase circular inclusion with interfacial rigid lines (anti-cracks) is investigated. An efficient and concise method for the complex multiply connected region is developed, with which explicit series form solutions of the complex potentials in the matrix, and the interphase layer and inclusion regions are derived. Based on the complex potentials, the image force on the screw dislocation is then calculated by using the Peach-Koehler formula. The equilibrium position of the dislocation is discussed in detail for various rigid line geometries, interphase layer thicknesses and material property combinations. The main results show that the interfacial rigid lines exert a significant perturbation effect on the motion of the screw dislocation near the circular inclusion surrounded by an interphase layer. | Fang Qihong Liu Youwen Jiang Chiping | 2005 | Acta Mechanica Solida Sinica2005，18，4： | 2 |
| 4 | A rigorous analytical method for doubly periodic cylindrical inclusions under longitudinal shear and its application显示文摘 | JIANG Chiping XU Yaoling CHEUNG Y K | 2004 | Mechanics of Materials2004，36，3： | 1 |
| 5 | A closed form solution to the antiplane problem of doubly periodic cracks of unequal size in piezoelectric materials显示文摘 | TONG Zhonghua JIANG Chiping | 2006 | Mechanics of Materials2006，38，4： | 1 |
| 6 | Direct numerical simulations on crack formation in ceramic materials under thermal shock by using a non-local fracture model 显示文摘 | Jia Li Fan Song Chiping Jiang | 2013 | J Eur Ceram Soc2013，，33： | 1 |
| 7 | Edge dislocation interacting with an interfacial crack along a circular inhomogeneity显示文摘 | Fang Qihong Liu Youwen Jiang Chiping | | 0，，： | 1 |
| 8 | SPECIAL HIGH-ORDER BENDING CRACK TIP FINITE ELEMENT FOR THE REISSNER PLATE显示文摘SPECIALHIGH┐ORDERBENDINGCRACKTIPFINITEELEMENTFORTHEREISSNERPLATEJiangChiping(DepartmentofFlightVehicleDesignandAppliedMechani... | Jiang Chiping (Department of Flight Vehicle Design and Applied Mechanics, Beijing University of Aeronautics and Astronautics. Beijing, 100083, China) Liu Chuntu (Institute of Mechanics, Chinese Academy of Sciences, Beijing, 100080, China) | 1997 | Chinese Journal of Aeronautics1997，10，4： | 0 |
| 9 | FRACTURE BEHAVIOUR OF SiC WHISKER REINFORCED Al COMPOSITES显示文摘The dynamic tensile processes of silicon carbide whisker reinforced Al composite(SiC_w/Al)with 22% V_f have been in situ observed with a scanning electron microscope equipped with atensile stand.The results show that a number of microcracks have formed as the tensile stressincreases to 180~190 MPa.Microcracks form in most cases at the whisker ends.The frac-ture behaviour of SiC_w/Al composite observed has been explained theoretically.KEY WORDS composite,fracture,stress distribution,SiC whiskers。 | CAO Li JIANG Chiping YAO Zhongkai LEI Tingquan Harbin Institute of Technology,Harbin,China | 1989 | Acta Metallurgica Sinica(English Letters)1989，2，12： | 0 |
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