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112篇 您的检索式：作者名="Kivilahti"

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	题名	作者	年代	出处	被引量
1	A diffusion-kinetic model for predicting solder/conductor interactions in high density interconnections 显示文摘	RONKA K J VAN LOO F J J KIVILAHTI J K	1998	Metall Trans A1998，29，12：	1
2	SEM observations on stress corrosion cracking of commercially pure titanium in a topical fluoride solution显示文摘	Mauno H O Kononen Eeva T Lavonius Jorma K Kivilahti	1995	Dent Mater1995，11，：	1
3	Fusing of dental ceramics to ti- tanium 显示文摘	Kononen M Kivilahti J	2001	J Dent ties2001，80，3：	1
4	lmpae, t of printed wiring board coatings on the reliability of lead-free chip-scaLe package interconnections 显示文摘	attila T T Vuorinen V Kivilahti J K	2004	Journal of Materials Research2004，，19：	1
5	Effect ofsurface processing on the attachment, orientation andproliferation of human gingival fibroblasts on titanium显示文摘	Konoken M Hormia M Kivilahti J	1992	J Biomed Master Res1992，26，：	1
6	A solder alloyfilled Z-Axis conductive epoxy adhesive显示文摘	Savolainen P Kivilahti J K	1995	Adhesive1995，49，：	1
7	Tantalum carbide and nitride diffusion barriers for Cu metallization 显示文摘	Laurila T Zeng K Kivilahti J K	2002	Microelectronic Engineering2002，60，12：	1
8	Formation of interfacial microstructure in brazing of Si3 N4 with Ti-activated Ag-Cu filler alloys显示文摘	Paulasto M Kivilahti J K	1995	Scrip- ta Materialia1995，32，8：	1
9	SEM observations on stress corrosion cracking of commercially pure titanium in a topical fluoride solution 显示文摘	MAUNO H KIINIINEN 0 LAVONIUS EEVA T KIVILAHTI JORMA K	1995	Dental Materials1995，11，4：	1
10	Bonding of low-fusing dental porcelain to commercially pure titanium显示文摘	K?n?nen M Kivilahti J		0，，09：	1
11	Bonding of low-fusing dental porcelain to commercially puretitanium显示文摘	Kononen M Kivilahti J	1994	J Biomed MaterRes1994，28，：	1
12	Interfaeial reactions be- tween lead free SnAgCu solder and Ni(P) surface finish on printed circuit boards显示文摘	Zeng K Vuor inen V Kivilahti J	2002	Electron Packag Manufact2002，25，3：	1
13	Bonding of low-fusing dental porcelain to commercially pure titanium显示文摘	Kononen M Kivilahti J	1994	J Biomed Mater Res1994，28，9：	1
14	Fusing of dental ceramics to titanium显示文摘	Kivilahti J	2001	J Dent Res2001，80，3：	1
15	Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system 显示文摘	Yu H Vuorinen V Kivilahti J K	2007	Journal of Electronic Materials2007，36，2：	1
16	lnterfacial reactions between lead-free solders and common base materials 显示文摘	LAURILA T VUORINEN V KIVILAHTI J K	2005	Mater Sci Eng2005，49，12：	1
17	Failure mechanisms of Lead-free chip scale package Interconnection under fast mechanical loading显示文摘	Mattila T T Kivilahti J K	2005	Journal of Electronic Materials2005，34，7：	1
18	Fusing of dental ceramics to titanium显示文摘	Kivilahti J	2001	J Dent Res2001，80，3：	1
19	Interfadal reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards 显示文摘	Zeng K Vuorinen V Kivilahti J	2002	Electronics Pachaging Manufacturing2002，25，3：	1
20	Inter- facial reactions between lead-free solders and common base materials 显示文摘	LAURILA T VUORINEN V KIVILAHTI J K	2005	Materials Science and Engineer- ing2005，49，18：	1

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