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12篇 您的检索式:作者名="LEE Chiapyng"
    题名 作者 年代 出处 被引量
1Evaluation of the thermal stability of reactively sputtered (Ti, Zr) Nc nano-thin films as diffusion barriers between Cu and Silicon显示文摘Kuo Yu-Lin Lee Chiapyng Lin Jing-Cheng 2005Thin Solid Films2005,484,:1
2Characteristics of sputtered Ta-B-N thin films as diffusion barriers between copper and silicon显示文摘Lin Shun tang Lee Chiapyng 2006Appl Surf Sei2006,253,3:1
3Characteristics of sputtered Ta-B-N thin films as diffusion barriers between copper and silicon显示文摘Shun-Tang Lin Chiapyng Lee 2006Appl Surf Sci2006,253,:1
4Characterization of tantalum nitride films deposited by reactive sputtering of Ta in N2/Ar gas mixtures 显示文摘Wen - Homg Lee Jing - Cheng Lin Chiapyng Lee 2001Materials Chemistry and Physics2001,68,:1
5Nucleation and growth of highly oriented lead titanate thin films prepared by a sol-gel method 显示文摘Lai Yen-chao Lin Jing-cheng Chiapyng Lee 1998Applied Surface Science1998,125,:1
6Characteristics of DC reactively sputtered ( Ti, Zr) N thin films as diffusion barriers for Cu metallization 显示文摘Kuo Yu - lin Lee Chiapyng Lin Jing - cheng 2003Electrochemical and Solid - State Letters2003,6,9:1
7Failure behavior of small outline J Lead/Sn - X ( X = AgCu or Pb )solder joints under thermal mechanical fatigue test显示文摘Pei Lin Wu Meng Kuang Huang Chiapyng Lee 2004Materials Chemistry and Physics2004,87,:1
8Characteristics of sputtered Ta-B-N thin films as diffusion barriers between copper and silicon显示文摘Lin Shun-Tang Lee Chiapyng 2006Appl Surf Sci2006,253,:1
9Effect of density on the diffusion barrier property of TiNx films between Cu and Si显示文摘Wen-Horng Lee Yu-Lin Kuo Hong-Ji Huang Chiapyng Lee 2004Materials Chemistry and Physics2004,85,23:1
10The 260 ℃ phase equilibria of the Sn-Sb-Cu ternary system and inteffacial reactions at the Sn-Sb/Cu joints 显示文摘Lee Chiapyng Lin Chung-yung Yen Yee-wen 2007Intennetallics2007,15,:1
11Effect of SiH4/CH4 flow ratio on the Growth of β-SiC on Si By Electron Cyclotron Chemical Vapor Deposition at 500 ℃显示文摘LiuChin-Chien Lee Chiapyng 1995Appl Phys Lett1995,66,2:1
12Characteristics of Sputter-deposited Gadolinia-doped Ceria Thin Films on Al_2O_3/SiO_2/Si Systems显示文摘Metal oxide films prepared by thin film technology have been reported for the potential applications on thin solid electrolyte layers for solid oxide fuel cells(SOFCs). Gadolinia-doped ceria(GDC) thin films and Al2O3 layers on SiO2/Si substrates are successively deposited by RF reactive magnetron sputtering from a cerium-gadolinium (90:10 at.%) alloy target and Al target in O2/Ar gas mixture and then perform post-thermal treatments at 300-700 ℃ and 900 ℃ for 2 h, respectively. Materials characteristics and chemical compositions of GDC films and Al2O3 layers are investigated by X-ray photoelectron spectroscopy(XPS), cross-sectional scanning electron microscopy(SEM), X-ray diffraction(XRD), and atomic force microscopy(AFM). Stoichiometric Al2O3 layers with polycrystalline structures are firstly prepared onto SiO2/Si substrates. A cubic fluorite structure with columnar crystallites of GDC films is successfully deposited on Al2O3/SiO2/Si systems. The chemical composition of 700 ℃-annealed GDC films is (Ce0.91Gd0.09)O1.94 and possesses a higher film density of 7.257 g/cm3. As a result, GDC thin films prepared by RF reactive magnetron sputtering and post-thermal treatments can be used as thin solid electrolyte layers for intermediate temperature SOFCs system as compared to the well-known yttria-stabilized zirconia(YSZ).KUO Yulin LEE Chiapyng CHEN Yongsiou SU Yuming LIANG Hsuang 2009Chinese Journal of Mechanical Engineering2009,22,3:0
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