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您的检索式：作者名="Satoshi OUE"
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| 1 | Effect of equal-channel angular pressing on pitting corrosion resistance of anodized aluminum-copper alloy显示文摘The effect of equal-channel angular pressing(ECAP) on the pitting corrosion resistance of anodized Al-Cu alloy was investigated by electrochemical techniques in a solution containing 0.2 mol/L AlCl3 and also by surface analysis.Anodizing was conducted for 20 min at 200 and 400 A/m2 in a solution containing 1.53 mol/L H2SO4 and 0.018 5 mol/L Al2(SO4)3·16H2O at 20 ℃.Anodized Al-Cu alloy was immediately dipped in boiling water for 20 min to seal the micro pores present in anodic oxide films.The time required before initiating pitting corrosion of anodized Al-Cu alloy is longer with ECAP than without,indicating that ECAP process improves the pitting corrosion resistance of anodized Al-Cu alloy.Second phase precipitates such as Si,Al-Cu-Mg and Al-Cu-Si-Fe-Mn intermetallic compounds are present in Al-Cu alloy and the size of these precipitates is greatly decreased by application of ECAP.Al-Cu-Mg intermetallic compounds are dissolved during anodization,whereas the precipitates composed of Si and Al-Cu-Si-Fe-Mn remain in anodic oxide films due to their more noble corrosion potential than Al.FE-SEM and EPMA observation reveal that the pitting corrosion of anodized Al-Cu alloy occurs preferentially around Al-Cu-Si-Fe-Mn intermetallic compounds,since the anodic oxide films are absent at the boundary between the normal oxide films and these impurity precipitates.The improvement of pitting corrosion resistance of anodized Al-Cu alloy processed by ECAP appears to be attributed to a decrease in the size of precipitates,which act as origins of pitting corrosion. | In-Joon SON Hiroaki NAKANO Satoshi OUE Shigeo KOBAYASHI Hisaaki FUKUSHIMA Zenji HORITA | 2009 | 中国有色金属学会会刊:英文版2009，19，4： | 5 |
| 2 | Pitting corro-sion resistance of anodized aluminum-copper alloy processed bysevere plastic deformation显示文摘 | Son In Joon Nakano Hiroaki Oue Satoshi | 2008 | Materials Transactions2008，49，11： | 1 |
| 3 | TEM-EDX observations of the microstructure of electrodeposited Ni Sn alloys显示文摘 | Satoshi Oue Hiroaki Nakano Ryo Kuroda | 2006 | Mater Transact2006，47，6： | 1 |
| 4 | In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions显示文摘The Ni samples were electroformed from additive-free(AF) and saccharin-containing(SC) sulfamate solutions, respectively. In situ backscattered electron(BSE) imaging, electron backscatter diffraction(EBSD), and electron-probe microanalysis(EPMA) were used to investigate the effect of annealing on the deformation behaviors of the AF and SC samples. The results indicate that columnar grains of the as-deposited AF sample had an approximated average width of 3 μm and an approximated aspect ratio of 8. The average width of columnar grains of the as-deposited SC sample was reduced to approximately 400 nm by the addition of saccharin to the electrolyte. A few very-large grains distributed in the matrix of the SC sample after annealing. No direct evidence indicated that S segregated at the grain boundaries before or after annealing. The average value of the total elongations of the SC samples decreased from 16% to 6% after annealing, whereas that of the AF samples increased from 18% to 50%. The dislocation recovery in grain-boundary areas of the annealed AF sample was reduced, which contributed to the appearance of microvoids at the triple junctions. The incompatibility deformation between very-large grains and fine grains contributed to the brittle fracture behavior of the annealed SC Ni. | Kai Jiang Hiroaki Nakano Satoshi Oue Tatsuya Morikawa Wen-huai Tian | 2019 | International Journal of Minerals,Metallurgy and Materials2019，26，1： | 0 |
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