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17篇 您的检索式:作者名="Seok D Y"
    题名 作者 年代 出处 被引量
1Fabrication of Fe-Si-B based amorphous powder cores by cold pressing and their magnetic properties显示文摘Kim Y B Jans D H Seok H K 0,,:1
2A fibrous stromal com- ponent in hepatocellular carcinoma reveals a cholangiocarci- nomalike gene expression trait and epithelial-mesenchymal transition 显示文摘SEOK J Y NA D C WOO I-/G 2012Hepatology2012,55,6:1
3Computer Simulation for the Die Filling Behavior of Semi-Solid Slurry of Mg Alloy 显示文摘LEE D Y MOON J H SEOK H K etc 2007Journal of Korea Foundry Society2007,27,1:1
4Hydrogen-induced toughness drop in weld coarse-grained heat-affected zones of linepipe steel显示文摘Lee J A Lee D H Seok M Y 2013Materials Characterization2013,82,:1
5Fabrication of Fe-Si-B based amorphous powder cores by cold pressing and their magnetic properties显示文摘Kim Y B Jang D H Seok H K 2007Mat Sci Eng A2007,449,:1
6Fabrication of Fe-Si-B Based Amorphous Powder Cores by Cold Pressing and Their Mag- netic Properties 显示文摘Kim Y B Jang D H Seok H K 2007Materials Science and Engineering: A2007,,449451:1
7A modified strategy for the synthesis of hyperbranched poly(p-phenylenevinylene) : Achieving extended u-conjugation with growing molecular weight显示文摘Lim S J Seok D Y Park S Y 2006Macromolecules2006,39,:1
8Relation between etching profile and voltage-current shape of sintered SiC etching by atmospheric pressure plasma显示文摘Sintered silicon carbide(SiC)was etched by a dielectric barrier discharge source.A high voltage bipolar pulse was used with helium gas for the plasma generation.One stable filament plasma was generated and could be used for SiC etching.As the processing gas(NF3)mixing rate increased,the width and depth of the etching profile became narrower and deeper.The differentiated V-Q Lissajous method was used for measuring the capacitances(Ceq)of the electrode after the plasma turned on.The width of the etching profile was proportional to Ceq.As the current peak value/smx of the substrate current in creased,the volume removal rate of SiC increased.The etch depth was proportional to the ratio of/smx to Ceq.Additionally,because of the different characteristics of the plasma disks on SiC substrate by the voltage polarity,the etching profile was unstable.However,in high NF3 mixing process,the etching profile became stable and deeper.D C SEOK S R YOO K I LEE Y S CHOI Y H JUNG 2019Plasma Science and Technology2019,21,4:1
9显示文摘Lira S J Seok D Y An B K 2006Macromolecules2006,39,:1
10Association between red cell distribution width and disease activity in patients with inflammatory bowel disease显示文摘Song C S Park D I Yoon M Y Seok H S Park J H Kim H J 2012Dig Dis Sci2012,57,:1
11Fabrication of bismuth telluride-based alloy thin film thermoelectric devices grown by metal organichemical vapor deposition显示文摘Sung D K Byeong K J Seok J Y 2009J Electron Mater2009,38,7:1
12A study on the short-circuit test by fault angle control and the recovery characteristics of the fault current limiter using coated conductor显示文摘PARK D K KIM Y J AHN M C YANG S E SEOK B Y KO T K 2007Physica C2007,,:1
13Interaction of elongation factor-1α and pleckstrin homology domain of phospholipase C -γ1 with activating its activity显示文摘Chang J S Seok H Kwon T K Min D S Ahn B H Lee Y H Suh J W Kim J W Iwashita S Omori A Ichinose S Numata O Seo J K Oh Y S Suh P G 2002The Journal of Biological Chemistry2002,277,22:1
14Solution structure of the 40,000 Mr phosphoryl transfer complex between the N-terminal domain of enzyme I and HPr显示文摘Garrett D S Seok Y J Peterkofsky A 1999Nat Struct Biol1999,6,2:1
15Thermal stress analysis for a disk brake of railway vehicles with consideration of the pres- sure distribution on a frictional surface 显示文摘Kim D J Lee Y M Park J S Seok C S 2008Materials Science and Engineering A2008,,15:1
16Interrogation of fiber grating sensor arrays with awavelength-swept fiber laser显示文摘Seok H Y Richardson D J Byoung Y K 1998Optics Lett1998,23,11:1
17Thermal stress analysis for a disk brake of railway vehicles with consideration of the pressure distribution on a frictional surface显示文摘KIM D J LEE Y M PARK J S SEOK C S 2008Material Science and Engineering A2008,,15:1
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