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| 1 | Mold-filling ability of semisolid alloy显示文摘The mold-filling ability of the semisolid alloy has very important effects on the quality and properties of the work pieces produced by the semisolid forming process. The factorial experiments show that all of the heating factors, such as mold temperature, heating temperature and the keeping time of billets, have some effects on the mold-filling ability of semisolid alloy. According to the analysis of influencing extent on the filling ability, it is found that the most important one of the factors is the mold temperature instead of the billets temperature, the next one is the heating temperature of the billet, and the keeping time rows on the third. It is also found that there is an interrelation between the billet heating temperature and the mold temperature. The effect of the interrelation on the mold-filling abilityis even stronger than the keeping time. The higher the mold temperature, heating temperature or the keeping time is, the better the mold-filling ability of the semisolid alloy is. The parameter to describe themold-filling ability, defined as the maximum filling height along theupright direction or the maximum filling length along the horizontal direction, can be theoretically determined according to the flowing theory of viscous fluid. | ShumingXing LizhongZhang DabenZeng JuntaoShi | 2002 | Journal of University of Science and Technology Beijing2002，9，4： | 2 |
| 2 | Basic rules for rheologic forging process of semisolid alloy显示文摘Semisolid mold forging is a major type of semisolid processing, which is different from neither traditional mold forging nor traditional permanent casting. However, processing defects are often seen in work pieces because of lacking available rules for the process design and control. Some basic rules for the process design and control, simply named the shortest flowing length, pressure filling and the minimum uplifting mold pressure, are advanced in the paper based on amount of researches and experiments. The equations to determine the major process parameters are given out such as the filling pressure, forming pressure and locking mold pressure for the process design and control. The rules and equations are experimentally proved available and applicable by several actual work pieces produced by the semisolid forging process. | ShumingXing LizhongZhang JianboTan ChuanlinZheng HanwuLiu PengZhang YunhuiDu | 2004 | Journal of University of Science and Technology Beijing2004，11，6： | 1 |
| 3 | Influence of Diffusion Time on Steel-Aluminum Solid to Liquid Bonding Interfacial Structure显示文摘The bonding of steel plate to aluminum liquid was conducted using rapid solidification.The influence of diffusion time on interfacial structure was studied.The results showed that under the condition of 750℃ for the temperature of aluminum liquid and 200℃ for the preheat temperature of steel plate,when diffusion time was shorter than 4.3s,there was only Fe-Al solid solution at the interface.When diffusion time was longer than 4.3s,Fe-Al compound began to form at the interface.The relationships between diffusion time t and thickness of Fe-Al compound layer H are H=-9.72+2.62t-0.08t^2(4.3s≤t≤15s)and H=2.79+0.647t=0.033t^2(t>15s). | PengZHANG Yunhui ShumingXING LizhongZHANG DabenZENG Jianzhong LiminBA | 2002 | Journal of Materials Science & Technology2002，18，5： | 0 |
| 4 | Thickness of compound layer in steel-aluminum solid to liquid bonding显示文摘The bonding of solid steel plate to liquid aluminum was studied using rapid solidification. The surface of solid steel plate was defatted, descaled, immersed (in K2ZrF6 flux aqueous solution) and stoved. In order to determine the thickness of Fe-A1 compound layer at the interface of steel-aluminum solid to liquid bonding under rapid solidification, the interface of bonding plate was investigated by SEM (Scanning Electron Microscope) experiment. The relationship between bonding parameters (such as preheat temperature of steel plate, temperature of aluminum liquid and bonding time) and thickness of Fe-Al compound layer at the interface was established by artificial neural networks (ANN) perfectly. The maximum of relative error between the output and the desired output of the ANN is only 5.4%. From the bonding parameters for the largest interfacial shear strength of bonding plate (226℃ for preheat temperature of steel plate, 723 ℃ for temperature of aluminum liquid and 15.8 s for bonding time), the reasonable thickness of Fe-A1 compound layer 10.8 μm was got. | PengZhang YunhuiDu HanwuLiu ShumingXing DabenZeng JianzhongCui LiminBa | 2003 | Journal of University of Science and Technology Beijing2003，10，5： | 0 |
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