维普期刊资源整合服务平台（V6.5）

150篇 您的检索式：作者名="Tummala R"

选中清除导出查看参考文献查看引证文献引用追踪共8页首页上一页第1页下一页末页 /8 跳转

	题名	作者	年代	出处	被引量
1	Fundamentals of microsystems packaging-the first fundamental, cross-disciplinary and system-level textbook 显示文摘	TUMMALA R R	2001	Adv Electron Packg2001，，3：	1
2	Climbing the walls显示文摘	TUMMALA R L MUKHERJEE R XI N	2002	IEEE Robotics & Automation Magazine2002，9，4：	1
3	Integral passive for next generation of electronic packaging: Application of epoxy/ceramic nanocomposites as integral capacitors 显示文摘	Bhattacharya S K Tummala R R	2001	Microelectronics Journal2001，32，1：	1
4	An application of the AHP in vendor selection of a telecommunications system 显示文摘	Tam M C Y Tummala V M R	2001	O- mega2001，29，2：	1
5	Nanostructured Co3O4electrodes for supercapacitor applications from plasma spray technique显示文摘	Tummala R Guduru R K Mohanty P S	2012	J Power Sources2012，209，：	1
6	Climbing the walls显示文摘	Tummala R Lal Mukherjee R Xi N Aslam D Dulimarta H Xiao Jizhong Minor M Dang G	2002	IEEE Robotics and Automation Magazine (R&A)2002，9，4：	1
7	Fuzzy logic data con'clarion approach in multi-sensor multi-target tracking systems 显示文摘	Aziz A M Tummala M Cristi R	1999	Signal Processing (S0165-1684)1999，76，2：	1
8	Surgical management of giantaneurysms of the middle cerebral artery显示文摘	Tummala R Heros RC Sheth R	2005	Oper Tech Neurosurg2005，8，2：	1
9	Ceramic and glass-ceramic packa- ging in the 1990s显示文摘	TUMMALA R R	1991	J Am Ceram Soc1991，74，5：	1
10	SOP: what is it and why? a new microsystems-integration technology paradigm Moore's law for system integration of miniaturized convergent systems of the next decade 显示文摘	TUMMALA R R	2004	IEEE Transactions on Advanced Packaging2004，27，2：	1
11	Neuroprotection in brain and spinal cord trauma 显示文摘	Fu E S Tummala R P	2005	Curr Opin Anaesthesiol2005，18，2：	1
12	SOP : microelectronic systems packagingtechnology for the 21st century 显示文摘	Tummala R	1999	Advancing Microe-lectronics1999，26，3：	1
13	Mobile robot navigation using artificial landmarks 显示文摘	Lin C Tummala R	1997	Journal of Robotic Systems1997，14，2：	1
14	Applying a Risk ManagementProcess(RMP)to manage cost risk for an EHV transmissionline project显示文摘	Tummala M R Burchett J F	1999	International Journal of Project Management1999，7，4：	1
15	Interfacial Water Properties in the Presence of Surfactants 显示文摘	Tummala N R Liu S Argyris D	2015	Langmuir2015，31，：	1
16	The value of computed tomography angiography in determining treatment allocation for aneurysmal subarachnoid hemorrhage显示文摘	Miley J T Taylor R A Janardhan V Tummala R Lanzino G Qureshi A I	2008	Neurocrit Care2008，9，：	1
17	Outcomes after aneurysm rupture during endovascular coil embolization显示文摘	Chu R M Madison M T	2001	Neurosurgery2001，49，5：	1
18	Outcomes after aneurysm rupture during endovascular coil embolization显示文摘	Tummala R P Chu R M Madison M T		0，，05：	1
19	Ceramic and glass-ceramic packaging in th 1990s显示文摘	Rao R Tummala	1991	J Am Ceram Soc1991，74，：	1
20	Assessing supply chain risks with the analytic hierarchy process: providing deci-sion support for the offshoring decision by a US manufacturing compa- ny 显示文摘	SCHOENHERR T TUMMALA V M R HARRISON T P	2008	Journal of Purchasing & Supply Management2008，14，2：	1

返回顶部每页显示：

共8页首页上一页第1页下一页末页 /8 跳转

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费

用户提示