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12篇 您的检索式:作者名="ee Y Z"
    题名 作者 年代 出处 被引量
1Copper diffusion in Ti-Si-N kyers formed by inductively coupled plasma implantation显示文摘Ee Y C Chen Z 2006Appl Surf Sci2006,253,:1
2Microstructure study of PANpitch-based carbon-carbon composite显示文摘L EE KJ CHEN Z Y 2003Materials Chemistry and Physics2003,82,:1
3Electroless copper seed layer deposition on tantalum nitride barrier film显示文摘Chong S P Ee Y C Chen Z 2005Surface and Coatings Tech2005,198,13:1
4Effect of processing parameters on electroless Cu seed layer properties显示文摘Ee Y C Chen Z Chan L 2004Thin Solid Films2004,,:1
5Formation and characterization of Ti-Si-N-O barrier films 显示文摘Ee Y C Chen Z Law S B 2006Thin Solid Films2006,504,12:1
6Electroless copper seed layer deposition on tantalum nitride barrier film显示文摘CHONG S P EE Y C CHEN Z 2005Surface &Coatings Tech2005,198,13:1
7Ontology-based fuzzy event extraction agent for Chinese e-news summarization 显示文摘EE C S CHEN Y J JIAN Z W 2003Expert Systems with Applications2003,25,:1
8Immunity-Based Ant Colony Optimization Algorithms for Solving Weapon-Target Assignment Problem显示文摘LEE Z J L EE C Y SU S F 0,,01:1
9Irnmunogenici- ty of CIGB-230, a therapeutic DNA vaccine preparation, in HCV-chronically infected individuals in a phase I clinical tri- al 显示文摘Alvarez-Lajonchere L Shoukry NH Gr6 B Amador- Cafiizares Y Helle F B6dard N Guerra I Drouin C Du- buisson J Gonz6lez-Horta EE Martlnez G Marante J Cinza Z Castellanos M Duefias-Carrera S 2009J Viral Hepat2009,16,3:1
10Copper diffusion in Ti-Si- N layers formed by inductively coupled plasma implantation 显示文摘Ee Y C Chen Z Law S B 2006Appl Surf Sci2006,253,:1
11Frietion and wear of hwonel 690 for steam generator tube in elevated temperature water tmder fretting eondition 显示文摘Jenng S H Cho C W 1 ee Y Z 2005Tribology International2005,38,3:1
12Effect of processing parameters on electroless Cu seed layer properties 显示文摘Ee Y C Chen Z Chan L 2004Thin Solid Films2004,197,:1
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