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32篇 您的检索式：期刊名="IEEE Trans Adv Packaging"

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	题名	作者	年代	出处	被引量
1	Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering显示文摘	HO C E TSAI S Y and KAO C R	2001	IEEE Trans Adv Packag2001，24，4：	1
2	Failure analysis and stress simulation in small multi-chip BGAs 显示文摘	MOORE T D JARVIS J L	2001	IEEE Trans on Adv Packaging2001，24，2：	1
3	High-frequency scala- ble electrical model and analysis of a through silicon via (TSV) 显示文摘	KIM J PAK J S CHO J	2011	IEEE Trans Adv Packag2011，1，2：	1
4	An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures 显示文摘	Haque S Xing K Lin R L	1999	IEEE Trans Adv Packag1999，22，2：	1
5	Therrnomigration versus electromigration in microelectronics solder joints显示文摘	Abdulhamid MF Basaran C Lai YS	2009	IEEE Trans Adv Packag2009，32，：	1
6	Analysis of a double microstrip discontinuity using generalized transmission line equations显示文摘	LIU Y W HONG J S MEI K K	2003	IEEE Trans Adv Packag2003，26，4：	1
7	A compact ltcc- based ku-band transmitter module 显示文摘	Lee C H Sutono A Han S	2002	IEEE Trans Adv Packag2002，25，3：	1
8	Analytical approach to temperature evaluation in bonding wires and calculation of allowable current显示文摘	Moser H	2000	IEEE Trans Adv Packaging2000，23，3：	1
9	Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method 显示文摘	Guo C	2006	IEEE Trans Adv Packag2006，29，3：	1
10	Application of the cavity model to lossy power-return plane structures in printed circuit boards 显示文摘	Xu M Wang H	2003	IEEE Trans Adv Packag2003，26，1：	1
11	Comparison between epi-down and epi-up bonded high-power single-mode 980 nm semiconductor lasers 显示文摘	LIU X S HU M H NGUYEN H K CANEAU C G RASMUSSEN M H	2004	IEEE Trans Adv Packag2004，27，4：	1
12	Full- Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media 显示文摘	Ong Chong-Jin Wu Boping Tsang Leung	2008	IEEE Trans on Adv Packag2008，31，2：	1
13	Analytical approach to temperature evaluation in bonding wires and calculation of allowable current显示文摘	Nobawer G T Moser H	2000	IEEE Trans Adv Packaging2000，23，3：	1
14	Estimating the power bus impedance of printed circuit boards with embedded capacitance显示文摘	Xu M Hubing T H	2002	IEEE Trans Adv Packag2002，25，3：	1
15	Reducing simultaneous switching noise and EMI on ground /power planes by dissipative edge termination显示文摘	Novak I	1999	IEEE Trans Adv Packag1999，22，3：	1
16	Distributed matched bypassing for board-level power distribution networks显示文摘	Novak I Noujeim L M Cyr V St	2002	IEEE Trans Adv Packag2002，25，2：	1
17	Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method 显示文摘	Guo C Hubing T	2006	IEEE Trans Adv Packag2006，29，3：	1
18	Simulating package behavior under power dissipation using uniform thermal loading 显示文摘	WAKIL J A HO P S	2001	IEEE Trans on Adv Packaging2001，24，1：	1
19	3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology显示文摘	Tentzeris M M Laskar J Papapolymerou J	2004	IEEE Trans Adv Packaging2004，27，2：	1
20	Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock 显示文摘	POON N M WU C M L LAI J K L	2000	IEEE Trans Adv Packaging2000，23，：	1

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