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| 1 | Effect of Catch Cup Geometry on 3D Boundary Layer Flow over the Wafer Surface in a Spin Coating显示文摘最近,当半导体仪器变得更复杂,高技术的开发在生产半导体的进程为薄一致电影的形成被要求了。旋转涂层通常被使用在晶片表面上散布光致抗蚀剂。然而,自从旋转,磁盘的速度在旋转涂层很高,扔的光致抗蚀剂向外散布并且在电影表面上重新依附。钩子杯在纺纱在晶片外面被建立涂层,和散布光致抗蚀剂薄雾被在在晶片边和钩子杯之间的差距产生的 exhaust 流动从晶片边移开。在旋转涂层的干燥过程,是一颗严肃的担心在低旋转的情况中的晶片边附近的电影厚度增加加速。这研究的目的是在晶片表面和液膜的弄干的率上在 3D 界面层流动上弄明白钩子杯几何学的效果。 | Mizue MUNEKATA Seiichi KIMURA Hiroaki KURISHIMA Jinsuke TANAKA Sohei YAMAMOTO Hiroyuki YOSHIKAWA Kazuyoshi MATSUZAKI Hideki OHBA | 2008 | Journal of Thermal Science2008，17，1： | 0 |
| 2 | Drying of Flowing Liquid Film on Rotating Disk显示文摘Recently,development of high technology has been required for the formation of uniform thin film in manufacturing processes of semiconductor as the precision instruments become more sophisticated.A method called spin coating is often used for spreading photoresist on a wafer surface and drying photoresist film.In spin coating process,photoresist is uniformly spread on the wafer surface by centrifugal force caused by rotating wafer.However,it is a serious concern that streaky lines,which are caused by spiral vortices,appear on the wafer surface and prevent the formation of uniform film in the case of high rotating speed.On the other hand,in the case of low rotating speed,a small hump of the film is formed near the wafer edge.The main purpose of this study is to make clear the drying characteristics of the flowing liquid film on the rotating wafer.Temperature distribution of the flowing liquid film is captured by an infrared thermal video camera and radial gradient of the film temperature is introduced in order to evaluate the drying characteristic of the flowing film under steady state condition.Effects of the flow rate of the liquid film on the film temperature are investigated.The film temperature gradually decreases in the radial direction in all cases.At low rotating speed,the radial gradient of the film temperature is almost constant widely.On the other hand,at high rotating speed,the radial gradient of the film temperature takes a certain maximum value.It is found that the location of the gradient peak corresponds with the transition region of the air boundary layer,in which spiral vortices swirl,and shifts to the inner side of the disk with an increase of the liquid flow rate. | Mizue MUNEKATA Jun NISHIYAMA Akira NOGUCHI Hiroaki KURISHIMA Hiroyuki YOSHIKAWA Hideki OHBA | 2010 | Journal of Thermal Science2010，19，3： | 0 |
| 3 | Scattering Characteristics of Liquid Droplets Spun Off from Rotating Disk Edge显示文摘Scattering characteristics of liquid droplets spun off from a rotating disk edge are experimentally investigated. In the present research, aluminum disks are utilized and ethanol is employed for liquid. Scattering phenomena of the droplets are captured by the high-speed digital camera. Frequency distribution of the droplet diameter is evaluated from these images and distributions of horizontal flying velocity and angle of the droplets were measured by PTV. Liquid filaments are stretched outward from the stagnant liquid layer by centrifugal force and skew complicatedly by aerodynamic force. Some peaks appear in the distribution of the scattered droplet diameter and they are origi- nated from large terminal droplets and small droplets generated from filamentwise breakup. Most of the scattered droplets fly slightly inside in the tangential direction of the disk edge. The droplets spun off from the thin disk scatter widely compared with that from the thick one. | Mizue MUNEKATA Akira NOGUCHI Jun NISHIYAMA Hiroaki KURISHIMA Hiroyuki YOSHIKAWA | 2012 | Journal of Thermal Science2012，21，1： | 0 |
| 4 | Influences of the Exhaust Flow on the Boundary Layer Flow on the Wafer Surface in Spin Coating System显示文摘Recently, development of high technology has been required for abe fomaafion of thin uniform film in manufacturing processes of semiconductor as the semiconductor become more sophisticated. Spin coating is usually used for spreading photoresist on a wafer surface. However, since rotating speed of the disk is very high in spin coating, the dropped resist scatters outward and reattaches to the film surface. So, the scattered resist is removed by the exhaust flow generated at the gap between the wafer edge and the catch cup. It is seriously concerned that the stripes called Ekman spiral vortices appears on the disk in the case of high rotating speed and the film thickness increases near the wafer edge in the case of low rotating speed, because it prevent the fomation of uniform film. The purpose of this study is to make clear the generation mechanism of Ekman spiral vortices and the influence of exhaust flow on it. Moreover the influence of the catch cup geometry on the wafer surface boundary layer flow is investigated. | Seiichi KIMURA Mizue MUNEKATA Hiroaki KURISHIMA Kazuyoshi MATSUZAKI Hideki OHBA | 2005 | Journal of Thermal Science2005，14，2： | 0 |
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