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9篇 您的检索式：作者名="Masaki Omiya"

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		题名	作者	年代	出处	被引量
	1	Adhesion Energy of Cu/polyimide Interface in Flexible Printed Circuits显示文摘	Shoji Kamiya Harunori Furuta Masaki Omiya	2007	Surface and Coatings Technology2007，202，47：	1
	2	8-O-Cinnamoylneoline, A New Alkaloid from the Flower Buds of Aconitum carmichaeli and its Toxic and Analgesic Activities显示文摘	Masanori Taki Kazuaki Niitu Yuji Omiya Masamichi Noguchi Mikio Fukuchi Masaki Aburada Minoru Okada	2003	Planta Med2003，，09：	1
	3	Mechanical characterization of Sn-Ag-based lead-free solders显示文摘	Masazumi Amagai Masako Watanabe Masaki Omiya	2002	Microelectronics Reliability2002，42，6：	1
	4	Mechanical characterization of Sn-Ag-based lead-free solders显示文摘	Masazumi Amagai Masako Watanabe Masaki Omiya	2002	Microelectronics Reliability2002，42，：	1
	5	Adhesion Energy of Cu/polyimide Interface in Flexible Printed Circuits显示文摘	Shoji Kamiya Harunori Furuta Masaki Omiya	2007	Surface and Coatings Technology2007，202，47：	1
	6	Generation of micro/nano hybrid surface structures on copper by femtosecond pulsed laser irradiation显示文摘The delamination of copper lead frames from epoxy molding compounds(EMC)is a severe problem for microelectronic devices,as it leads to reduced heat dissipation or circuit breakage.The micro/nanoscale surface structuring of copper is a promising method to improve the copper-EMC interfacial adhesion.In this study,the generation of micro/nano hybrid structures on copper surfaces through femtosecond pulsed laser irradiation is proposed to improve interfacial adhesion.The micro/nano hybrid structures were realized by generating nanoscale laser-induced periodic surface structures(LIPSS)on microscale parallel grooves.Several types of hybrid surface structures were generated by changing the laser polarization direction,fluence,and scanning speed.At a specific aspect ratio of microgrooves,a latticed structure was generated on the sides of microgrooves by combining LIPSS formation and direct laser interference patterning.This study provides an efficient method for the micro/nanoscale hybrid surface structure formation for interfacial adhesion improvement between copperand EMC.	Ayumi Nakajima Masaki Omiya Jiwang Yan	2022	Nanomanufacturing and Metrology2022，5，3：	1
	7	Mechanical characterization of Sn-Ag based lead-free solder显示文摘	Masazumi Amagai Masako Watanabe Masaki Omiya	2002	Microelectronics Reliability2002，，42：	1
	8	Adhesion Energy of Cu/polyimide Interface in Flexible Printed Circuits显示文摘	Shoji Kamiya Harunori Furuta Masaki Omiya	2007	Surface and Coatings Technology2007，202，47：	1
	9	Adhesion Energy of Cu/Polyimide Interface in Flexible Printed Circuits显示文摘	Shoji Kamiya Harunori Furuta Masaki Omiya	2007	Surface and Coatings Technology2007，202，47：	1

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