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| 1 | Mirror-enhanced scanning light-field microscopy for long-term high-speed 3D imaging with isotropic resolution显示文摘Various biological behaviors can only be observed in 3D at high speed over the long term with low phototoxicity.Light-field microscopy(LFM)provides an elegant compact solution to record 3D information in a tomographic manner simultaneously,which can facilitate high photon efficiency.However,LFM still suffers from the missing-cone problem,leading to degraded axial resolution and ringing effects after deconvolution.Here,we propose a mirrorenhanced scanning LFM(MiSLFM)to achieve long-term high-speed 3D imaging at super-resolved axial resolution with a single objective,by fully exploiting the extended depth of field of LFM with a tilted mirror placed below samples.To establish the unique capabilities of MiSLFM,we performed extensive experiments,we observed various organelle interactions and intercellular interactions in different types of photosensitive cells under extremely low light conditions.Moreover,we demonstrated that superior axial resolution facilitates more robust blood cell tracking in zebrafish larvae at high speed. | Bo Xiong Tianyi Zhu Yuhan Xiang Xiaopeng Li Jinqiang Yu Zheng Jiang Yihan Niu Dong Jiang Xu Zhang Lu Fang Jiamin Wu Qionghai Dai | 2021 | Light(Science & Applications)2021，10，12： | 1 |
| 2 | 220 GHz Multi Circuit Integrated Front End Based on Solid-State Circuits for High Speed Communication System显示文摘This paper presents the research on a 220 GHz multi circuit inte-grated front end based on solidstate circuits. This integrated front end integrates a 220 GHz subharmonic mixer, a 110 GHz tripler, a 110 GHz 8 d B hybrid coupler and a 220 GHz waveguide bandpass filter(BPF) in one single block. Compared to the traditional transceivers which usually use cascade connection of the independent mixers and multipliers, the size of the proposed multi circuit integrated front-end block is 25 mm × 20 mm × 20 mm, ten times smaller than the cascading transceiver. In order to check the tripler’s output power, a modified compact 110 GHz 8 d B hybrid coupler is set between mixer and tripler. Due to the characteristics of the hybrid coupler, the deterioration of cascading transceiver’s performance caused by mismatch has also been improved. In addition, to achieve single sideband(SSB) communication, a 220 GHz BPF with high selectivity is integrated in the circuit. The measured conversion loss of the fabricated multi circuit integrated front end is less than 11 d B, where the LO and RF frequency are 37 and 210-220 GHz. Based on this front-end, a 220 GHz high speed communication system has been setup and it can achieve 10 Gbps data transmission using 16 QAM modulation. | NIU Zhongqian ZHANG Bo DAI Bingli ZHANG Jicong SHEN Fang HU Yi FAN Yong ZHANG Yihan | 2022 | Chinese Journal of Electronics2022，31，3： | 1 |
| 3 | Scaling relationships of elastic-perfectly plastic film/coating materials from small scale sharp indentation显示文摘The scaling relationships of elastic-perfectly plastic film/coating materials during sharp indentation have been obtained using dimensional analysis and finite-element modeling. Besides the bulk substrate materials, a wide range of film/coating materials with different ratios in term of the Young’s modulus and yield strength were examined, namely different values of Ef/Esand Yf/Es.Based on these scaling relationships, the substrate effects on indentation response and deformed surface profile of residual imprint are given. Furthermore, the scaling relationship among the work of indentation, reduced elastic modulus and hardness has been found. It is found that the ratio of the indentation hardness to measurement of substrate elastic modulus could be used to characterize the wear resistance of film/coating materials. In addition, a novel method to acquire the intrinsic hardness and elastic modulus of film/coating materials is proposed combined with the well-known 10% critical indentation depth rule, which avoids the error caused by estimating the contact area. This work could be contributed for characterizing the mechanical properties of film/coating materials at micro-and nanoscale. | WANG ZhaoXin WANG JiRu WANG Wen Yang NIU YiHan LI Cong ZONG XiangYu ZHANG JianHai ZHAO HongWei | 2021 | Science China(Technological Sciences)2021，64，6： | 1 |
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