| 3 | Low-Cost High-Performance 10 G Transmitter and Receiver Optical Subassembly显示文摘We describe briefly here the recent R&D activities in the optical subassembly packaging technologies at the Hong Kong Applied Science and Technology Research Institute (ASTRI). We have designed, developed and prototyped multiple of low-cost high performance packages for serial and parallel transmitters and receivers, in particular, the novel chip-in-plastic (CiP) package designed for 10G serial transmission for data communications. | K.S. Cheng E. Cheung R. Cheung S. Cheung A. Chow C.W. Fan H.W. Ho A. Hui M.W.K. Mak S.K. Lam S.L. Lau K.S. Lee A. Siu S.K. Yau F. Tong | 2003 | 光学学报2003，23，S1： | 0 |
您所在的机构暂未开通此部分的功能，请联系管理员