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| 1 | Agreement among 3 Methods to Measure Corneal Thickness: Ultrasound Pachymetry, Orbscan II, and Visante Anterior Segment Optical Coherence Tomography显示文摘 | Emmy Y.M. Li Shaheeda Mohamed Christopher K.S. Leung Srinivas K. Rao Arthur C.K. Cheng Carol Y.L. Cheung Dennis S.C. Lam | 2007 | Ophthalmology2007，，10： | 2 |
| 2 | Central corneal thickness measurements using Orbscan II, Visante, ultrasound, and Pentacam pachymetry after laser in situ keratomileusis for myopia显示文摘 | Thomas Ho Arthur C.K. Cheng Srinivas K. Rao Silvania Lau Chris K.S. Leung Dennis S.C. Lam | 2007 | Journal of Cataract & Refractive Surgery2007，，7： | 1 |
| 3 | Technology transfer and innovation performance: Evidence from Chinese firms显示文摘 | Jian Cheng Guan Chiu Kam Mok Richard C.M. Yam K.S. Chin Kit Fai Pun | 2005 | Technological Forecasting & Social Change2005，，6： | 1 |
| 4 | The hypertrophic scar and microcirculation properties显示文摘 | J.A. Clark K.S. Leung J.C.Y. Cheng P.C. Leung | 1996 | Burns1996，，6： | 1 |
| 5 | The hypertrophic scar and microcirculation properties显示文摘 | J.A. Clark K.S. Leung J.C.Y. Cheng P.C. Leung | 1996 | Burns1996，，6： | 1 |
| 6 | The ultraviolet emission mechanism of ZnO thin film fabricated by sol–gel technology显示文摘 | P.T. Hsieh Y.C. Chen K.S. Kao M.S. Lee C.C. Cheng | 2007 | Journal of the European Ceramic Society2007，，13： | 1 |
| 7 | Central corneal thickness measurements using Orbscan II, Visante, ultrasound, and Pentacam pachymetry after laser in situ keratomileusis for myopia显示文摘 | Thomas Ho Arthur C.K. Cheng Srinivas K. Rao Silvania Lau Chris K.S. Leung Dennis S.C. Lam | 2007 | Journal of Cataract & Refractive Surgery2007，，7： | 1 |
| 8 | Comparison of photocatalytic activities of various dye-modified TiO 2 thin films under visible light显示文摘 | K.S. Yao T.C. Cheng S.J. Li L.Y. Yang K.C. Tzeng C.Y. Chang Y. Ko | 2008 | Surface & Coatings Technology2008，，5： | 1 |
| 9 | Low-Cost High-Performance 10 G Transmitter and Receiver Optical Subassembly显示文摘We describe briefly here the recent R&D activities in the optical subassembly packaging technologies at the Hong Kong Applied Science and Technology Research Institute (ASTRI). We have designed, developed and prototyped multiple of low-cost high performance packages for serial and parallel transmitters and receivers, in particular, the novel chip-in-plastic (CiP) package designed for 10G serial transmission for data communications. | K.S. Cheng E. Cheung R. Cheung S. Cheung A. Chow C.W. Fan H.W. Ho A. Hui M.W.K. Mak S.K. Lam S.L. Lau K.S. Lee A. Siu S.K. Yau F. Tong | 2003 | 光学学报2003，23，S1： | 0 |
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