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3篇 您的检索式:作者名="Hojoon Lee"
    题名 作者 年代 出处 被引量
1Development of a wall-climbing robot using a tracked wheel mechanism显示文摘Hwang Kim Dongmok Kim Hojoon Yang Kyouhee Lee Kunchan Seo Doyoung Chang Jongwon Kim 2008Journal of Mechanical Science and Technology2008,,8:1
2Development of a wall-climbing robot using a tracked wheel mechanism显示文摘Hwang Kim Dongmok Kim Hojoon Yang Kyouhee Lee Kunchan Seo Doyoung Chang Jongwon Kim 2008Journal of Mechanical Science and Technology2008,,8:1
3Mechanically resilient,alumina-reinforced carbon nanotube arrays for in-plane shock absorption in micromechanical devices显示文摘Microelectromechanical systems(MEMS)are of considerable interest due to their compact size and low power consumption when used in modern electronics.MEMS devices intrinsically incorporate three-dimensional(3D)microstructures for their intended operations;however,these microstructures are easily broken by mechanical shocks accompanying high-magnitude transient acceleration,inducing device malfunction.Although various structural designs and materials have been proposed to overcome this limit,developing a shock absorber for easy integration into existing MEMS structures that effectively dissipates impact energy remains challenging.Here,a vertically aligned 3D nanocomposite based on ceramic-reinforced carbon nanotube(CNT)arrays is presented for in-plane shock-absorbing and energy dissipation around MEMS devices.This geometrically aligned composite consists of regionally-selective integrated CNT arrays and a subsequent atomically thick alumina layer coating,which serve as structural and reinforcing materials,respectively.The nanocomposite is integrated with the microstructure through a batch-fabrication process and remarkably improves the in-plane shock reliability of a designed movable structure over a wide acceleration range(0-12,000g).In addition,the enhanced shock reliability through the nanocomposite was experimentally verified through comparison with various control devices.Eunhwan Jo Hojoon Lee Jae-Ik Lee Jongbaeg Kim 2023Microsystems & Nanoengineering2023,9,3:0
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