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| 1 | A thermal actuated switchable dry adhesive with high reversibility for transfer printing显示文摘Transfer printing based on switchable adhesive that heterogeneously integrates materials is essential to develop novel electronic systems,such as flexible electronics and micro LED displays.Here,we report a robust design of a thermal actuated switchable dry adhesive,which features a stiff sphere embedded in a thermally responsive shape memory polymer(SMP)substrate and encapsulated by an elastomeric membrane.This construct bypasses the unfavorable micro-and nano-fabrication processes and yields an adhesion switchability of over1000 by combining the peel-rate dependent effect of the elastomeric membrane and the thermal actuation of the sub-surface embedded stiff sphere.Experimental and numerical studies reveal the underlying thermal actuated mechanism and provide insights into the design and operation of the switchable adhesive.Demonstrations of this concept in stamps for transfer printing of fragile objects,such as silicon wafers,silicon chips,and inorganic micro-LED chips,onto challenging non-adhesive surfaces illustrate its potential in heterogeneous material integration applications,such as flexible electronics manufacturing and deterministic assembly. | Shun Zhang Hongyu Luo Suhao Wang Zhou Chen Shuang Nie Changying Liu Jizhou Song | 2021 | International Journal of Extreme Manufacturing2021，3，3： | 2 |
| 2 | Switchable dry adhesive based on shape memory polymer with hemispherical indenters for transfer printing显示文摘Transfer printing based on switchable adhesive is essential for developing unconventional systems,including flexible electronics,stretchable electronics,and micro light-emitting diode(LED)displays.Here we report a design of switchable dry adhesive based on shape memory polymer(SMP)with hemispherical indenters,which offers a continuously tunable and reversible adhesion through the combination of the preloading effect and the thermal actuation of SMP.Experimental and numerical studies reveal the fundamental aspects of design,fabrication,and operation of the switchable dry adhesive.Demonstrations of this adhesive concept in transfer printing of flat objects(e.g.,silicon wafers),three-dimensional(3D)objects(e.g.,stainless steel balls),and rough objects(e.g.,frosted glasses)in two-dimensional(2D)or 3D layouts illustrate its unusual manipulation capabilities in heterogeneous material integration applications. | Hongyu Luo Chenglong Li Chuanqian Shi Shuang Nie Jizhou Song | 2021 | Theoretical & Applied Mechanics Letters2021，11，6： | 1 |
| 3 | Direct roll transfer printed silicon nanoribbon arrays based high-performance flexible electronics显示文摘Transfer printing of high mobility inorganic nanostructures,using an elastomeric transfer stamp,is a potential route for highperformance printed electronics.Using this method to transfer nanostructures with high yield,uniformity and excellent registration over large area remain a challenge.Herein,we present the‘direct roll transfer’as a single-step process,i.e.,without using any elastomeric stamp,to print nanoribbons(NRs)on different substrates with excellent registration(retaining spacing,orientation,etc.)and transfer yield(∼95%).The silicon NR based field-effect transistors printed using direct roll transfer consistently show high performance i.e.,high on-state current(Ion)>1 mA,high mobility(μ_(eff))>600 cm^(2)/Vs,high on/off ratio(I_(on)/_(off))of around 10^(6),and low hysteresis(<0.4 V).The developed versatile and transformative method can also print nanostructures based on other materials such as GaAs and thus could pave the way for direct printing of high-performance electronics on large-area flexible substrates. | Ayoub Zumeit Abhishek Singh Dahiya Adamos Christou Dhayalan Shakthivel Ravinder Dahiya | 2021 | npj Flexible Electronics2021，5，1： | 1 |
| 4 | Failure mechanisms in flexible electronics显示文摘The rapid evolution of flexible electronic devices promises to revolutionize numerous fields by expanding the applications of smart devices.Nevertheless,despite this vast potential,the reliability of these innovative devices currently falls short,especially in light of demanding operation environment and the intrinsic challenges associated with their fabrication techniques.The heterogeneity in these processes and environments gives rise to unique failure modes throughout the devices'lifespan.To significantly enhance the reliability of these devices and assure long-term performance,it is paramount to comprehend the underpinning failure mechanisms thoroughly,thereby,enabling,optimal design solutions.A myriad of investigative efforts have been dedicated to unravel these failure mechanisms,utilizing a spectrum of tools from analytical models,numerical methods,to advanced characterization methods.This review delves into the root causes of device failure,scrutinizing both the fabrication process and the operation environment.Next,We subsequently address the failure mechanisms across four commonly observed modes:strength failure,fatigue failure,interfacial failure,and electrical failure,followed by an overview of targeted characterization methods associated with each mechanism.Concluding with an outlook,we spotlight ongoing challenges and promising directions for future research in our pursuit of highly resilient flexible electronic devices. | Zhehui Zhao Haoran Fu Ruitao Tang Bocheng Zhang Yunmin Chen Jianqun Jiang | 2023 | International Journal of Smart and Nano Materials2023，14，4： | 0 |
| 5 | Sacrificial layer-assisted nanoscale transfer printing显示文摘Transfer printing is an emerging assembly technique for flexible and stretchable electronics.Although a variety of transfer printing methods have been developed,transferring patterns with nanometer resolution remains challenging.We report a sacrificial layer-assisted nanoscale transfer printing method.A sacrificial layer is deposited on a donor substrate,and ink is prepared on and transferred with the sacrificial layer.Introducing the sacrificial layer into the transfer printing process eliminates the effect of the contact area on the energy release rate(ERR)and ensures that the ERR for the stamp/ink-sacrificial layer interface is greater than that for the sacrificial layer/donor interface even at a slow peel speed(5mm s−1).Hence,large-area nanoscale patterns can be successfully transferred with a yield of 100%,such as Au nanoline arrays(100 nm thick,4 mm long and 47 nm wide)fabricated by photolithography techniques and PZT nanowires(10mm long and 63nm wide)fabricated by electrohydrodynamic jet printing,using only a blank stamp and without the assistance of any interfacial chemistries.Moreover,the presence of the sacrificial layer also enables the ink to move close to the mechanical neutral plane of the multilayer peel-off sheet,remarkably decreasing the bending stress and obviating cracks or fractures in the ink during transfer printing. | Junshan Liu Bo Pang Riye Xue Rui Li Jinlong Song Xiaojun Zhao Dazhi Wang Xiaoguang Hu Yao Lu Liding Wang | 2020 | Microsystems & Nanoengineering2020，6，1： | 0 |
| 6 | Fabrication of patterned transparent conductive glass via laser metal transfer for efficient electrical heating and antibacteria显示文摘Vapor deposition and three-dimensional(3D)printing technology are considered to be conventional methods to achieve patterned metal film preparation through the assistance of masks and high temperature.Therefore,there are still some challenges in fabricating metal films in template-free and normal temperature environment.In this work,we report a flexible and rapid laser metal transfer(LMT)technique for fabricating the various metal films(Cu,Ni,Sn,Al,Fe,and Ag)with different patterns without templates on arbitrary substrates(glass,polyimide(PI)films,and aluminum nitride(AlN)ceramic).Especially,the obtained transparent conductive glass displays high transmittance(more than 90%)and adjustable resistances(≈5Ω).According to the Joule effect,the interface resistance between Cu particles and copper oxide coating produces the high temperature approximately 280℃ at 2 V in a short time(≈60 s)and remains stable at 120℃ over 12 h.At last,the multifunctional glass with Cu patterns also shows excellent bactericidal activity(≈95%).This work demonstrates that laser metal transfer is an exceeding effective means of fabricating the micro/nano structures with potential applications in functional devices. | Xiaoyan Liu Ting Zhang Mengchen Xu Yang Li Haiqing Wang Yuke Chen Xuzihan Zhang Zenan Wang Xiaoyan Li Weijia Zhou Hong Liu | 2024 | Nano Research2024，17，3： | 0 |
| 7 | Conformal manufacturing of soft deformable sensors on the curved surface显示文摘Health monitoring of structures and people requires the integration of sensors and devices on various 3D curvilinear,hierarchically structured,and even dynamically changing surfaces.Therefore,it is highly desirable to explore conformal manufacturing techniques to fabricate and integrate soft deformable devices on complex 3D curvilinear surfaces.Although planar fabrication methods are not directly suitable to manufacture conformal devices on 3D curvilinear surfaces,they can be combined with stretchable structures and the use of transfer printing or assembly methods to enable the device integration on 3D surfaces.Combined with functional nanomaterials,various direct printing and writing methods have also been developed to fabricate conformal electronics on curved surfaces with intimate contact even over a large area.After a brief summary of the recent advancement of the recent conformal manufacturing techniques,we also discuss the challenges and potential opportunities for future development in this burgeoning field of conformal electronics on complex 3D surfaces. | Wanqing Zhang Ling Zhang Yabin Liao Huanyu Cheng | 2021 | International Journal of Extreme Manufacturing2021，3，4： | 0 |
| 8 | 干燥环境下表面黏附性能调控研究进展显示文摘实现黏附可控是解决微/纳机械产品黏附失效问题和发展先进黏附材料及新型微操作/微装配技术等的有效途径.基于该研究背景,针对干燥不带电系统,对近年来发展的几类黏附调控方法进行了综述,从表面改形、材料改性及外场控制三方面介绍了织构、涂层/薄膜和复合材料、速度、温度、外力和磁场在黏附调控方面的研究进展,分析和总结了各类方法的黏附调控机理、关键影响因素和特点,并指出了应用领域,介绍了多手段复合调控黏附方法的最新研究成果.最后,探讨了当前黏附调控方面存在的问题和未来可能的发展方向. | 张玉言 蒋玲 于波 马晨波 | 2022 | 摩擦学学报2022，42，2： | 0 |
| 9 | 柔性电子聚合物表面金属化工艺的研究进展显示文摘柔性聚合物具有低密度,极高的柔韧性和可变形等特点,可作为柔性电子器件的基材广泛应用于射频通讯天线、传感检测、医疗健康和微电子等领域。由于柔性聚合物的低导电性和较差的机械特性,限制了其进一步的发展。化学镀、激光成型和真空沉积镀膜等工艺方法可有效改善柔性聚合物的电学、光学等物理性能,成为近几年的研究热点,为柔性电子器件制备的图案化、微型化和可定制化提供了有效的解决方案。总结近年来在柔性电子领域常见的表面金属化工艺的研究进展,详细论述了工艺参数对柔性电子材料在性能上的影响规律及作用机制,指出其具备的优势和不足,并对未来的发展方向做出展望。 | 张超 马迅 王静静 刘平 马凤仓 张柯 李伟 | 2023 | 功能材料2023，54，7： | 0 |
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