|
|
|
题名
|
作者
|
年代
|
出处
|
被引量
|
| 1 | 查看详情显示文摘 | M.Zheng J.Cao X.Ke G.Ji Y.Chen K.Shen J.Tao | | 0，，： | 1 |
| 2 | 查看详情显示文摘 | M.Zheng G.Ji Y.Wang J.Cao S.Feng L.Liao Q.Du L.Zhang Z.Ling J.Liu T.Yu J.Cao J.Tao | | 0，，： | 1 |
| 3 | CREG inhibits migration of human vascular smooth muscle cells by mediating IGF-Ⅱ endocytosis显示文摘 | Y.Han J.Cui J.Tao L.Guo P | | 0，，： | 1 |
| 4 | Study on the Exploitation of Bohai Sea Ice as Freshwater Resources显示文摘 | Y.B. Lin Y.J.Xu W.Gu S.Yuan D.Y.Bu J.Tao | 2011 | Journal of Environmental Science and Engineering2011，5，7： | 0 |
| 5 | Research and development of the back-end electronics for the two-dimensional improved resistive plate chambers in CMS upgrade显示文摘Purpose To complement and ensure redundancy in the endcap muon system of the Compact Muon Solenoid(CMS)detector and to extend the Resistive Plate Chamber(RPC)system coverage,improved RPCs(iRPCs)with either orthogonal layer strips with one-end electronics or single layer strips with two-end electronics providing more precise time measurement will be installed in the very forward pseudorapidity region of|η|<2.4.The iRPC readout system needs to support twodimensional(2D)or two-end readout.In addition,it must combine detector data with Timing,Trigger and fast Control(TTC)and Slow Control(SC)into one data stream over a bi-directional optical link with a line rate of 4.8 Gb/s between the Front-End Electronics(FEE)and the Back-End Electronics(BEE).To fulfill these requirements,a prototype BEE for the iRPC 2D chamber has been researched and designed.Methods A Micro-Telecommunication and Computing Architecture(μTCA)-based processing card was designed in this study to establish a prototype system together with aμTCA crate.The Giga-Bit Transceiver(GBT)protocol is integrated to provide bi-directional communication between the FEE and BEE.A server is connected with the BEE by a Gigabit Ethernet(GbE)link for SC and a 10-GbE link for Data AcQuisition(DAQ).Results The Bit Error Rate(BER)test of the back-end board and a joint test with the iRPC 2D prototype chamber were performed.ABERof less than 1.331×10−16 was obtained.The timemeasurement with a resolution of 3.05 nswas successfully realized,and detector efficiencies of 97.7%for longitudinal strips and 96.0%for orthogonal strips were measured.Test results demonstrate the correctness and reliability of the prototype BEE.Conclusion The BEE prototype satisfies the requirements for the iRPC 2D chamber,and it worked stably and reliably during a long-term joint test run. | P.Cao Z-A.Liu J.Zhao H.Kou J.Tao J.Song W.Gong N.Wang A.Samalan M.Tytgat N.Zaganidis G.A.Alves F.Marujo F.Torres.Da.S.ilva.De.Araujo E.M.Da Costa D.De Jesus Damiao H.Nogima A.Santoro S.Fonseca De Souza A.Aleksandrov R.Hadjiiska P.Iaydjiev M.Rodozov M.Shopova G.Sultanov M.Bonchev A.Dimitrov L.Litov B.Pavlov P.Petkov A.Petrov S.J.Qian C.Bernal A.Cabrera J.Fraga A.Sarkar S.Elsayed Y.Assran M.El Sawy M.A.Mahmoud Y.Mohammed X.Chen C.Combaret M.Gouzevitch G.Grenier I.Laktineh L.Mirabito K.Shchablo I.Bagaturia D.Lomidze I.Lomidze V.Bhatnagar R.Gupta P.Kumari J.Singh V.Amoozegar B.Boghrati M.Ebraimi R.Ghasemi M.Mohammadi Najafabadi E.Zareian M.Abbrescia R.Aly W.Elmetenawee N.De Filippis A.Gelmi G.Iaselli S.Leszki F.Loddo I.Margjeka G.Pugliese D.Ramos L.Benussi S.Bianco D.Piccolo S.Buontempo A.Di Crescenzo F.Fienga G.De Lellis L.Lista S.Meola P.Paolucci A.Braghieri P.Salvini P.Montagna C.Riccardi P.Vitulo B.Francois T.J.Kim J.Park S.Y.Choi B.Hong K.S.Lee J.Goh H.Lee J.Eysermans C.Uribe Estrada I.Pedraza H.Castilla-Valdez A.Sanchez-Hernandez C.A.Mondragon Herrera D.A.Perez Navarro G.A.Ayala Sanchez S.Carrillo E.Vazquez A.Radi A.Ahmad I.Asghar H.Hoorani S.Muhammad M.A.Shah I.Crotty | 2021 | Radiation Detection Technology and Methods2021，5，2： | 0 |
| 6 | Characterization of the first prototype CMOS pixel sensor developed for the CEPC vertex detector显示文摘Purpose CMOS pixel sensor has become extremely attractive for future high-performance tracking devices.It has been proposed for the vertex detector at the Circular Electron Positron Collider,which will allow precision measurements of the properties of the Higgs boson.To meet the stringent requirements for low power consumption,it is necessary to optimize the pixel sensor diode geometry to reach a high charge-over-capacitance ratio that allows reduction in analog power consumption.Methods Collection electrode size and footprint are two critical elements in sensor diode geometry and have deciding impacts on the charge collection performance.A prototype CMOS pixel sensor,named JadePix-1,has been developed with pixel sectors implemented with different electrode sizes and footprints,and its charge collection performance has been characterized with radioactive sources.Results Charge-to-voltage conversion gains for pixel sectors under test have been calibrated with low-energy X-rays.Characterization results have been obtained for equivalent noise charge(below 10e−),charge collection efficiency(around 40%),charge-over-capacitance ratio(above 0.015 V)and signal-to-noise ratio(higher than 55).Conclusion Small collection electrode size and large footprint are preferred to achieve high charge-over-capacitance ratio that promises low analog power consumption.Ongoing studies on sensor performance before and after irradiation,combined with this work,will conclude the diode geometry optimization. | L.J.Chen H.B.Zhu X.C.Ai M.Fu R.Kiuchi Y.Liu Z.A.Liu X.C.Lou Y.P.Lu Q.Ouyang X.Shi J.Tao K.Wang N.Wang C.F.Yang Y.Zhang Y.Zhou | 2019 | Radiation Detection Technology and Methods2019，3，3： | 0 |
| 7 | Mechanical properties of SWNT X-Junctions through molecular dynamics simulation显示文摘The mechanical behavior of seven different carbon nanotube(CNT)X-junctions with a varying number of bonds was investigated through molecular dynamics simulations.The X-junctions are composed of two(6,0)single-walled carbon nanotubes(SWNTs)created via vibration-assisted heat welding.The junctions,containing anywhere between one and seven bonds,are subject to uniaxial tensile,shear and torsional strain,and then the stiffness values are determined for each case.When subjected to tensile and shear strain,both the arrangement and orientation of bonds are found to affect the stiffness of junctions more substantially than the number of bonds,bond length or bond order.Surprisingly,anisotropic shear behavior is observed in the X-junctions,which can be attributed to the junction’s bond orientation.Also,the stiffness of X-junctions tested under an applied torque(torsion)differs from the stiffness under tensile and shear strain,however,in that it is more substantially affected by the number of bonds present in the junction than by any other property. | B.A.Stormer N.M.Piper X.M.Yang J.Tao Y.Fu M.Kirca A.C.To | 2012 | International Journal of Smart and Nano Materials2012，3，1： | 0 |
您所在的机构暂未开通此部分的功能，请联系管理员